AT32UC3L064-AUT Atmel, AT32UC3L064-AUT Datasheet - Page 73

• Manufacturer Part Number: AT32UC3L064-AUT
• Description: MCU AVR32 64KB FLASH 48TQFP
• Manufacturer: Atmel
• Series: AVR®32 UC3r

Specifications of AT32UC3L064-AUT

• Core Processor: AVR
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, PWM, WDT
• Number Of I /o: 36
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.62 V ~ 3.6 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-TQFP, 48-VQFP
• Processor Series: AT32UC3x
• Core: AVR32
• Data Bus Width: 32 bit
• Data Ram Size: 16 KB
• Interface Type: SPI/TWI/USART
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 36
• Number Of Timers: 7
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR32, EWAVR32-BL
• Development Tools By Supplier: AT32UC3L-EK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 9-ch x 10-bit
• Package: 48TQFP
• Device Core: AVR32
• Family Name: AT32
• Maximum Speed: 50 MHz
• Operating Supply Voltage: 1.8|3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

8. Mechanical Characteristics
8.1
8.1.1
8.1.2
32099F–11/2010
Thermal Considerations
Thermal Data
Junction Temperature
Table 8-1
Table 8-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
JA
JC
Table
42.
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
=
8-1.
summarizes the thermal resistance data depending on the package.
T
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
JA
)
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
Still Air
AT32UC3L016/32/64
TLLGA48
TLLGA48
Package
TQFP48
TQFP48
QFN48
QFN48
Section 7.5 on page
Table
30.06
63.2
21.8
28.3
TBD
Typ
2.5
8-1.
J
°C/W
°C/W
°C/W
in °C.
Unit
73