PIC18F2525-E/SP Microchip Technology, PIC18F2525-E/SP Datasheet - Page 292
![IC MCU FLASH 24KX16 28-DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC18F2525-E/SP
Manufacturer Part Number
PIC18F2525-E/SP
Description
IC MCU FLASH 24KX16 28-DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18F2221-ISO.pdf
(46 pages)
2.PIC18F2525-ISO.pdf
(412 pages)
3.PIC18F2525-ISO.pdf
(18 pages)
4.PIC18F2525-ISO.pdf
(18 pages)
5.PIC18F2525-ISO.pdf
(6 pages)
6.PIC18F2525-ISO.pdf
(6 pages)
Specifications of PIC18F2525-E/SP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
48KB (24K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3986 B
Interface Type
SPI, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
1 x 8
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163022, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
For Use With
I3DB18F4620 - BOARD DAUGHTER ICEPIC3DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F2525-E/SP
Manufacturer:
Microchip Technology
Quantity:
135
- PIC18F2221-ISO PDF datasheet
- PIC18F2525-ISO PDF datasheet #2
- PIC18F2525-ISO PDF datasheet #3
- PIC18F2525-ISO PDF datasheet #4
- PIC18F2525-ISO PDF datasheet #5
- PIC18F2525-ISO PDF datasheet #6
- Current page: 292 of 412
- Download datasheet (7Mb)
PIC18F2525/2620/4525/4620
IORLW
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
DS39626E-page 290
Q Cycle Activity:
Before Instruction
After Instruction
Decode
W
W
Q1
=
=
Inclusive OR Literal with W
IORLW k
0 ≤ k ≤ 255
(W) .OR. k → W
N, Z
The contents of W are ORed with the
eight-bit literal ‘k’. The result is placed in
W.
1
1
IORLW
literal ‘k’
Read
0000
Q2
9Ah
BFh
1001
35h
Process
Data
Q3
kkkk
Write to W
Q4
kkkk
IORWF
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
Q Cycle Activity:
Before Instruction
After Instruction
Decode
RESULT =
W
RESULT =
W
Q1
=
=
register ‘f’
Inclusive OR W with f
IORWF
0 ≤ f ≤ 255
d ∈ [0,1]
a ∈ [0,1]
(W) .OR. (f) → dest
N, Z
Inclusive OR W with register ‘f’. If ‘d’ is
‘0’, the result is placed in W. If ‘d’ is ‘1’,
the result is placed back in register ‘f’
(default).
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f ≤ 95 (5Fh). See
Section 24.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
1
1
IORWF
Read
0001
Q2
13h
91h
13h
93h
© 2008 Microchip Technology Inc.
RESULT, 0, 1
f {,d {,a}}
00da
Process
Data
Q3
ffff
destination
Write to
Q4
ffff
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