PIC18F2420-I/SO Microchip Technology, PIC18F2420-I/SO Datasheet - Page 367
PIC18F2420-I/SO
Manufacturer Part Number
PIC18F2420-I/SO
Description
IC MCU FLASH 8KX16 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18F2420-IML.pdf
(412 pages)
2.PIC18F2420-IML.pdf
(16 pages)
3.PIC18F2420-IML.pdf
(8 pages)
4.PIC18F2420-IML.pdf
(6 pages)
5.PIC18F2420-IML.pdf
(8 pages)
6.PIC18F2420-IML.pdf
(4 pages)
7.PIC18F4420-IP.pdf
(390 pages)
Specifications of PIC18F2420-I/SO
Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
SPI/I2C/USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163014, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit
Package
28SOIC W
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F2420-I/SO
Manufacturer:
MICROCHIP
Quantity:
1 560
Part Number:
PIC18F2420-I/SO
Manufacturer:
NXP/恩智浦
Quantity:
20 000
- PIC18F2420-IML PDF datasheet
- PIC18F2420-IML PDF datasheet #2
- PIC18F2420-IML PDF datasheet #3
- PIC18F2420-IML PDF datasheet #4
- PIC18F2420-IML PDF datasheet #5
- PIC18F2420-IML PDF datasheet #6
- PIC18F4420-IP PDF datasheet #7
- Current page: 367 of 390
- Download datasheet (8Mb)
28.2
The following sections give the technical details of the packages.
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
2004 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
Package Details
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
eB
A1
E1
B1
D
p
A
E
L
B
n
c
PIC18F2420/2520/4420/4520
MIN
1.345
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
Preliminary
5
5
B
B1
INCHES*
NOM
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
28
10
10
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
6.99
3.18
0.20
8.13
7.62
1.02
0.41
5
5
MILLIMETERS
p
NOM
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
28
10
10
DS39631A-page 365
A2
L
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15
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