PIC18F2220-E/SP Microchip Technology, PIC18F2220-E/SP Datasheet - Page 194
PIC18F2220-E/SP
Manufacturer Part Number
PIC18F2220-E/SP
Description
IC MCU FLASH 2KX16 EEPROM 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F2220-ISO.pdf
(394 pages)
3.PIC18F2220-ISO.pdf
(6 pages)
4.PIC18F2220-ISO.pdf
(6 pages)
5.PIC18F2220-ISO.pdf
(8 pages)
6.PIC18F2220-ISO.pdf
(6 pages)
7.PIC18F2220-ISO.pdf
(6 pages)
Specifications of PIC18F2220-E/SP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
4KB (2K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
SPI, I2C, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
2 x 8 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, ICE2000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
For Use With
DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC18F2220-ISO PDF datasheet #2
- PIC18F2220-ISO PDF datasheet #3
- PIC18F2220-ISO PDF datasheet #4
- PIC18F2220-ISO PDF datasheet #5
- PIC18F2220-ISO PDF datasheet #6
- PIC18F2220-ISO PDF datasheet #7
- Current page: 194 of 394
- Download datasheet (7Mb)
PIC18F2220/2320/4220/4320
17.4.17.2
During a Repeated Start condition, a bus collision
occurs if:
a)
b)
When the user deasserts SDA and the pin is allowed to
float high, the BRG is loaded with SSPADD<6:0> and
counts down to 0. The SCL pin is then deasserted and
when sampled high, the SDA pin is sampled.
FIGURE 17-29:
FIGURE 17-30:
DS39599G-page 192
A low level is sampled on SDA when SCL goes
from low level to high level.
SCL goes low before SDA is asserted low, indi-
cating that another master is attempting to
transmit a data ‘1’.
SDA
SCL
BCLIF
RSEN
S
SSPIF
SDA
SCL
RSEN
BCLIF
S
SSPIF
Bus Collision During a Repeated
Start Condition
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
BUS COLLISION DURING A REPEATED START CONDITION (CASE 2)
SCL goes low before SDA,
set BCLIF. Release SDA and SCL.
T
BRG
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL.
If SDA is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’, Figure 17-29).
If SDA is sampled high, the BRG is reloaded and begins
counting. If SDA goes from high-to-low before the BRG
times out, no bus collision occurs because no two
masters can assert SDA at exactly the same time.
If SCL goes from high-to-low before the BRG times out
and SDA has not already been asserted, a bus collision
occurs. In this case, another master is attempting to
transmit a data ‘1’ during the Repeated Start condition
(see Figure 17-30).
If at the end of the BRG time-out, both SCL and SDA
are still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated Start condition is
complete.
T
Cleared in software
© 2007 Microchip Technology Inc.
BRG
Interrupt cleared
in software
‘0’
‘0’
‘0’
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