PIC18F2431-I/SO Microchip Technology, PIC18F2431-I/SO Datasheet - Page 251
PIC18F2431-I/SO
Manufacturer Part Number
PIC18F2431-I/SO
Description
IC PIC MCU FLASH 8KX16 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F818-ISO.pdf
(6 pages)
3.PIC18F2331-ISO.pdf
(392 pages)
4.PIC18F2331-ISO.pdf
(8 pages)
5.PIC18F2331-ISO.pdf
(6 pages)
6.PIC18F2331-ISO.pdf
(16 pages)
7.PIC18LF2331-ISO.pdf
(40 pages)
8.PIC18F2431-ISP.pdf
(396 pages)
Specifications of PIC18F2431-I/SO
Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
EUSART/I2C/SPI/SSP
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
24
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM183021, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 10-bit
Package
28SOIC W
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILI3-DB18F4431 - BOARD DAUGHTER ICEPIC3
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F2431-I/SO
Manufacturer:
MICROCHIP
Quantity:
2 000
Part Number:
PIC18F2431-I/SO
Manufacturer:
NXP/恩智浦
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC16F818-ISO PDF datasheet #2
- PIC18F2331-ISO PDF datasheet #3
- PIC18F2331-ISO PDF datasheet #4
- PIC18F2331-ISO PDF datasheet #5
- PIC18F2331-ISO PDF datasheet #6
- PIC18LF2331-ISO PDF datasheet #7
- PIC18F2431-ISP PDF datasheet #8
- Current page: 251 of 392
- Download datasheet (4Mb)
21.4
If external voltage references are used instead of the
internal AV
impedance of the V
must be considered. During acquisition, currents
supplied by these sources are insignificant. However,
during conversion, the A/D module sinks and sources
current through the reference sources.
In order to maintain the A/D accuracy, the voltage
reference source impedances should be kept low to
reduce voltage changes. These voltage changes occur
as reference currents flow through the reference
source impedance.
21.5
The ADCON2 register allows the user to select an acqui-
sition time that occurs each time an A/D conversion is
triggered.
When the GO/DONE bit is set, sampling is stopped and
a conversion begins. The user is responsible for ensuring
the required acquisition time has passed between
selecting the desired input channel and the start of
conversion. This occurs when the ACQT<3:0> bits
(ADCON2<6:3>) remain in their Reset state (‘0000’).
TABLE 21-2:
2010 Microchip Technology Inc.
Note 1:
Note:
2:
3:
4:
A/D Voltage References
Selecting and Configuring
Automatic Acquisition Time
Operation
The RC source has a typical T
The RC source has a typical T
For device frequencies above 1 MHz, the device must be in Sleep for the entire conversion or the A/D
accuracy may be out of specification unless in Single-Shot mode.
Low-power devices only.
When using external references, the
source impedance of the external voltage
references must be less than 75 in order
to achieve the specified ADC resolution. A
higher reference source impedance will
increase the ADC offset and gain errors.
Resistive voltage dividers will not provide a
low enough source impedance. To ensure
the best possible ADC performance, exter-
nal V
op amp or other low-impedance circuit.
16 T
32 T
64 T
RC/4
2 T
4 T
8 T
DD
RC
OSC
OSC
OSC
OSC
OSC
OSC
(3)
REF
AD Clock Source (T
and AV
(3)
T
AD
REF
inputs should be buffered with an
vs. DEVICE OPERATING FREQUENCIES
+ and V
SS
sources, the source
REF
- voltage sources
AD
ADCS<2:0>
)
AD
AD
000
100
001
101
010
110
011
111
time of 2-6 s.
time of 0.5-1.5 s.
PIC18F2331/2431/4331/4431
If desired, the ACQT bits can be set to select a
programmable acquisition time for the A/D module.
When triggered, the A/D module continues to sample
the input for the selected acquisition time, then
automatically
acquisition time is programmed, there may be no need
to wait for an acquisition time between selecting a
channel and triggering the A/D. If an acquisition time is
programmed, there is nothing to indicate if the
acquisition time has ended or if the conversion has
begun.
21.6
The A/D conversion time per bit is defined as T
A/D conversion requires 12 T
The source of the A/D conversion clock is software
selectable. There are eight possible options for T
For correct A/D conversions, the A/D conversion clock
(T
minimum T
A11
Table 21-2
the device operating frequencies and the A/D clock
source selected.
AD
PIC18FXX31
1.00 MHz
) must be as short as possible, but greater than the
4.0 MHz
• 2 T
• 4 T
• 8 T
• 16 T
• 32 T
• 64 T
• Internal RC Oscillator
• Internal RC Oscillator/4
for more information).
19.2 MHz
38.4 MHz
40.0 MHz
40.0 MHz
4.8 MHz
9.6 MHz
Selecting the A/D Conversion
Clock
Maximum Device Frequency
OSC
OSC
OSC
OSC
OSC
OSC
shows the resultant T
AD
(2)
(1)
(approximately 416 ns, see parameter
begins
a
conversion.
AD
PIC18LFXX31
per 10-bit conversion.
AD
1.00 MHz
10.65 MHz
21.33 MHz
4.0 MHz
1.33 MHz
2.66 MHz
5.33 MHz
DS39616D-page 251
666 kHz
times derived from
(2)
Since
(2)
(4)
AD
AD
. The
the
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