PIC16C773/SP Microchip Technology, PIC16C773/SP Datasheet - Page 177

• Manufacturer Part Number: PIC16C773/SP
• Description: IC MCU OTP 4KX14 A/D PWM 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C773/SP

• Core Size: 8-Bit
• Program Memory Size: 7KB (4K x 14)
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Number Of I /o: 22
• Program Memory Type: OTP
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 6x12b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Controller Family/series: PIC16C
• No. Of I/o's: 22
• Ram Memory Size: 256Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C, SPI, SSP, UART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 3
• Maximum Operating Temperature: + 70 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: 0 C
• On-chip Adc: 12 bit, 6 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMING
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: PIC16C773-20/SP

17.2
1999 Microchip Technology Inc.
K04-070 28-Lead Skinny Plastic Dual In-line (SP) – 300 mil
Units
Dimension Limits
PCB Row Spacing
Number of Pins
Pitch
Lower Lead Width
Upper Lead Width
Shoulder Radius
Lead Thickness
Top to Seating Plane
Top of Lead to Seating Plane
Base to Seating Plane
Tip to Seating Plane
Package Length
Molded Package Width
Radius to Radius Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter.
†
‡
Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
n
R
eB
E1
E
2
1
c
D
n
p
B
B1
R
c
A
A1
A2
L
D
E
E1
eB
‡
‡
A2
†
A
Advance Information
MIN
0.016
0.040
0.000
0.008
0.140
0.070
0.015
0.125
1.345
0.280
0.270
0.320
5
5
INCHES*
NOM
B
B1
0.300
0.100
0.019
0.053
0.005
0.010
0.150
0.090
0.020
0.130
1.365
0.288
0.283
0.350
28
10
10
MAX
0.022
0.065
0.010
0.012
0.160
0.110
0.025
0.135
1.385
0.295
0.295
0.380
15
15
MIN
34.16
0.41
1.02
0.00
0.20
3.56
1.78
0.38
3.18
7.11
6.86
8.13
MILLIMETERS
5
5
PIC16C77X
NOM
p
34.67
7.62
2.54
0.48
1.33
0.13
0.25
3.81
2.29
0.51
3.30
7.30
7.18
8.89
28
10
10
DS30275A-page 177
L
A1
MAX
35.18
0.56
1.65
0.25
0.30
4.06
2.79
0.64
3.43
7.49
7.49
9.65
15
15