PIC16C773/SP Microchip Technology, PIC16C773/SP Datasheet - Page 180

• Manufacturer Part Number: PIC16C773/SP
• Description: IC MCU OTP 4KX14 A/D PWM 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C773/SP

• Core Size: 8-Bit
• Program Memory Size: 7KB (4K x 14)
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Number Of I /o: 22
• Program Memory Type: OTP
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 6x12b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Controller Family/series: PIC16C
• No. Of I/o's: 22
• Ram Memory Size: 256Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C, SPI, SSP, UART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 3
• Maximum Operating Temperature: + 70 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: 0 C
• On-chip Adc: 12 bit, 6 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMING
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: PIC16C773-20/SP

PIC16C77X
17.5
DS30275A-page 180
K04-073 28-Lead Plastic Shrink Small Outline (SS) – 5.30 mm
Units
Dimension Limits
Pitch
Number of Pins
Overall Pack. Height
Shoulder Height
Standoff
Molded Package Length
Molded Package Width
Outside Dimension
Shoulder Radius
Gull Wing Radius
Foot Length
Foot Angle
Radius Centerline
Lead Thickness
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
n
†
‡
p
*
Controlling Parameter.
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
E1
E
R1
p
n
A
A1
A2
D
E
E1
R1
R2
L
L1
c
B
‡
‡
†
Advance Information
2
1
L1
MIN
L
0.068
0.026
0.002
0.396
0.205
0.301
0.005
0.005
0.015
0.000
0.005
0.010
D
R2
0
0
0
A2
INCHES
NOM
0.026
0.073
0.036
0.005
0.402
0.208
0.306
0.005
0.005
0.020
0.005
0.007
0.012
A
28
4
5
5
MAX
0.078
0.046
0.008
0.407
0.212
0.311
0.010
0.010
0.025
0.010
0.009
0.015
10
10
8
MIN
10.07
1.73
0.66
0.05
5.20
7.65
0.13
0.13
0.38
0.00
0.13
0.25
MILLIMETERS*
0
0
0
1999 Microchip Technology Inc.
NOM
10.20
0.65
1.86
0.91
0.13
5.29
7.78
0.13
0.13
0.51
0.13
0.18
0.32
28
4
5
5
MAX
10.33
A1
1.99
1.17
0.21
5.38
7.90
0.25
0.25
0.64
0.25
0.22
0.38
10
10
8