DSPIC33FJ64GS610-E/PT Microchip Technology, DSPIC33FJ64GS610-E/PT Datasheet - Page 375

• Manufacturer Part Number: DSPIC33FJ64GS610-E/PT
• Description: MCU/DSP 16BIT 64KB FLASH 100TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ64GS610-E/PT

• Program Memory Type: FLASH
• Program Memory Size: 64KB (64K x 8)
• Package / Case: 100-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, QEI, POR, PWM, WDT
• Number Of I /o: 85
• Ram Size: 9K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 24x10b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Numeric And Arithmetic Format: Fixed-Point or Floating-Point
• Instruction Set Architecture: Harvard
• Device Million Instructions Per Second: 40 MIPs
• Maximum Clock Frequency: 120 MHz
• Number Of Programmable I/os: 85
• Data Ram Size: 4 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 24 Channel
• On-chip Dac: 10 bit, 4 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

FIGURE 27-13:
TABLE 27-32: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
 2010 Microchip Technology Inc.
AC CHARACTERISTICS
SP70
SP71
SP72
SP73
SP30
SP31
SP35
SP40
SP41
SP50
SP51
SP52
Note 1:
Param
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
No.
Note: Refer to Figure 27-1 for load conditions.
2:
3:
(CKP = 0)
(CKP = 1)
SS
SCK
SCK
SDO
SDI
TscL
TdoR
TscL2doV
TdiV2scH,
TdiV2scL
TscL2diL
TssL2scH,
TssL2scL
TssH2doZ
TscH
TscF
TscR
TdoF
TscH2doV,
TscH2diL,
X
TscH2ssH
TscL2ssH
X
Symbol
X
X
X
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
Assumes 50 pF load on all SPIx pins.
SCKx Input Low Time
SCKx Input High Time
SCKx Input Fall Time
SCKx Input Rise Time
SDOx Data Output Fall Time
SDOx Data Output Rise Time
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input to
SCKx Edge
SSx  to SCKx  or SCKx Input
SSx  to SDOx Output
High-Impedance
SSx after SCKx Edge
SPIx MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS
SP50
SP35
Characteristic
SP71
SP40
MSb In
MSb
SP70
SP41
(1)
SP30,SP31
Preliminary
Bit 14 - - - -1
Bit 14 - - - - - -1
1.5 T
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Min
120
30
30
20
20
10
—
—
—
—
—
CY
+40
SP73
SP72
Typ
10
10
—
—
—
—
—
—
—
—
—
—
(2)
SP72
SP73
LSb
LSb In
Max
25
25
30
50
—
—
—
—
—
—
—
—
SP52
-40°C  T
-40°C  T
Units
SP51
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
A
A
 +85°C for Industrial
 +125°C for Extended
See Note 3
See Note 3
See parameter D032
and Note 3
See parameter D031
and Note 3
See Note 3
DS70591C-page 375
Conditions