PIC18F2515-I/SP Microchip Technology, PIC18F2515-I/SP Datasheet - Page 354
![IC MCU FLASH 24KX16 28-DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC18F2515-I/SP
Manufacturer Part Number
PIC18F2515-I/SP
Description
IC MCU FLASH 24KX16 28-DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18F2221-ISO.pdf
(46 pages)
2.PIC18LF2410-ISO.pdf
(376 pages)
3.PIC18LF2410-ISO.pdf
(8 pages)
4.PIC18F2515-ISO.pdf
(16 pages)
5.PIC18F2515-ISO.pdf
(6 pages)
6.PIC18F2515-ISO.pdf
(8 pages)
Specifications of PIC18F2515-I/SP
Core Size
8-Bit
Program Memory Size
48KB (24K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Type
FLASH
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Controller Family/series
PIC18
No. Of I/o's
25
Ram Memory Size
3968Byte
Cpu Speed
40MHz
No. Of Timers
4
Interface
I2C, SPI, USART
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F2515-I/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC18F2221-ISO PDF datasheet
- PIC18LF2410-ISO PDF datasheet #2
- PIC18LF2410-ISO PDF datasheet #3
- PIC18F2515-ISO PDF datasheet #4
- PIC18F2515-ISO PDF datasheet #5
- PIC18F2515-ISO PDF datasheet #6
- Current page: 354 of 376
- Download datasheet (7Mb)
PIC18F2X1X/4X1X
DS39636D-page 356
28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 2 3
b
D
Dimension Limits
e
Units
A2
E1
A2
A1
E1
L1
N
A
E
D
e
h
L
φ
b
α
β
c
α
E
2.05
0.10
0.25
0.40
0.18
0.31
MIN
φ
0°
5°
5°
–
L1
L
MILLMETERS
10.30 BSC
17.90 BSC
1.27 BSC
7.50 BSC
1.40 REF
h
NOM
28
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-052B
h
© 2009 Microchip Technology Inc.
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
8°
β
–
c
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