ATMEGA162-16MU Atmel, ATMEGA162-16MU Datasheet - Page 2

• Manufacturer Part Number: ATMEGA162-16MU
• Description: IC AVR MCU 16K 16MHZ 5V 44-QFN
• Manufacturer: Atmel
• Series: AVR® ATmegar

Specifications of ATMEGA162-16MU

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 35
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 512 x 8
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-VQFN Exposed Pad
• Processor Series: ATMEGA16x
• Core: AVR8
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: JTAG/SPI/USART
• Maximum Clock Frequency: 16 MHz
• Number Of Programmable I/os: 35
• Number Of Timers: 4
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR, EWAVR-BL
• Development Tools By Supplier: ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT
• Minimum Operating Temperature: - 40 C
• Package: 44MLF EP
• Device Core: AVR
• Family Name: ATmega
• Maximum Speed: 16 MHz
• Controller Family/series: AVR MEGA
• No. Of I/o's: 35
• Eeprom Memory Size: 512Byte
• Ram Memory Size: 1KB
• Cpu Speed: 16MHz
• Rohs Compliant: Yes
• For Use With: ATSTK600-TQFP44 - STK600 SOCKET/ADAPTER 44-TQFPATSTK600 - DEV KIT FOR AVR/AVR32770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATAVRISP2 - PROGRAMMER AVR IN SYSTEMATJTAGICE2 - AVR ON-CHIP D-BUG SYSTEMATSTK500 - PROGRAMMER AVR STARTER KIT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Pin
Configurations
Disclaimer
2
ATmega162/V
Figure 1. Pinout ATmega162
Typical values contained in this datasheet are based on simulations and characterization of
other AVR microcontrollers manufactured on the same process technology. Min and Max values
will be available after the device is characterized.
(TOSC1/XCK0/OC3A) PD4
NOTE:
MLF bottom pad should
be soldered to ground.
(OC1A/TOSC2) PD5
(INT0/XCK1) PD2
(TOSC1/XCK0/OC3A) PD4
(INT1/ICP3) PD3
(RXD0) PD0
(MOSI) PB5
(MISO) PB6
(TXD0) PD1
(OC1A/TOSC2) PD5
(SCK) PB7
(RXD1/AIN0) PB2
(INT0/XCK1) PD2
(TXD1/AIN1) PB3
(INT1/ICP3) PD3
RESET
(SS/OC3B) PB4
(OC0/T0) PB0
(OC2/T1) PB1
VCC
(RXD0) PD0
(TXD0) PD1
(MOSI) PB5
(MISO) PB6
(SCK) PB7
(WR) PD6
(RD) PD7
RESET
XTAL2
XTAL1
1
2
3
4
5
6
7
8
9
10
11
GND
44
12
43
13
42
14
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
41
15
40
16
TQFP/MLF
PDIP
39
17
38
18
37
19
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
36
20
35
21
34
22
VCC
PA0 (AD0/PCINT0)
PA1 (AD1/PCINT1)
PA2 (AD2/PCINT2)
PA3 (AD3/PCINT3)
PA4 (AD4/PCINT4)
PA5 (AD5/PCINT5)
PA6 (AD6/PCINT6)
PA7 (AD7/PCINT7)
PE0 (ICP1/INT2)
PE1 (ALE)
PE2 (OC1B)
PC7 (A15/TDI/PCINT15)
PC6 (A14/TDO/PCINT14)
PC5 (A13/TMS/PCINT13)
PC4 (A12/TCK/PCINT12)
PC3 (A11/PCINT11)
PC2 (A10/PCINT10)
PC1 (A9/PCINT9)
PC0 (A8/PCINT8)
33
32
31
30
29
28
27
26
25
24
23
PA4 (AD4/PCINT4)
PA5 (AD5/PCINT5)
PA6 (AD6/PCINT6)
PA7 (AD7/PCINT7)
PE0 (ICP1/INT2)
GND
PE1 (ALE)
PE2 (OC1B)
PC7 (A15/TDI/PCINT15)
PC6 (A14/TDO/PCINT14)
PC5 (A13/TMS/PCINT13)
2513KS–AVR–07/09