DSPIC30F5013-20E/PT Microchip Technology, DSPIC30F5013-20E/PT Datasheet - Page 58

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DSPIC30F5013-20E/PT

Manufacturer Part Number
DSPIC30F5013-20E/PT
Description
IC DSPIC MCU/DSP 66K 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F5013-20E/PT

Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
Number Of I /o
68
Program Memory Size
66KB (22K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
80-TFQFP
For Use With
DM300024 - KIT DEMO DSPICDEM 1.1XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPDM300004-2 - BOARD DEMO DSPICDEM.NET 2DM300004-1 - BOARD DEMO DSPICDEM.NET 1AC30F007 - MODULE SKT FOR DSPIC30F 80TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
DSPIC30F5013-20EP

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F5013-20E/PT
Manufacturer:
MAXIM
Quantity:
101
Part Number:
DSPIC30F5013-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F5013-20E/PT
Manufacturer:
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Quantity:
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13.0
TABLE 13-1:
DS70102K-page 58
AC/DC CHARACTERISTICS
D110
D112
D113
D001
D002
D031
D041
D080
D090
D012
P1
P1a
P1b
P2
P3
P4
P4a
P5
P6
P7
P8
P9a
Param.
No.
AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS
V
I
I
V
V
V
V
V
V
C
T
T
T
T
T
T
T
T
T
T
T
T
PP
DDP
SCLK
SCLK
SCLK
SET
SET
IL
IH
OL
OH
HLD
DLY
DLY
DLY
HLD
DLY
DLY
IHH
DD
DDBULK
IO
Sym
1
2
1
1a
2
3
4
1
2
L
H
AC/DC CHARACTERISTICS
High Programming Voltage on MCLR/V
Programming Current on MCLR/V
Supply Current during programming
Supply voltage
Supply voltage for Bulk Erase
programming
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Capacitive Loading on I/O Pin (PGD)
Serial Clock (PGC) period
Serial Clock (PGC) low time
Serial Clock (PGC) high time
Input Data Setup Timer to PGC ↓
Input Data Hold Time from PGC ↓
Delay between 4-bit command and
command operand
Delay between 4-bit command operand
and next 4-bit command
Delay between last PGC ↓ of command to
first PGC ↑ of VISI output
V
Input data hold time from MCLR/V
Delay between last PGC ↓ of command
word to PGD driven ↑ by programming
executive
Programming Executive Command
processing time
DD
↑ setup time to MCLR/V
Characteristic
PP
PP
PP
PP
Standard Operating Conditions
(unless otherwise stated)
Operating Temperature: 25° C is recommended
V
0.8 V
DD
9.00
Min
V
400
400
100
2.5
4.5
50
20
20
15
15
20
20
20
20
10
1
2
5
SS
- 0.7
DD
0.2 V
13.25
Max
V
300
5.5
5.5
0.6
30
30
30
50
DD
SS
© 2010 Microchip Technology Inc.
Units
mA
mA
mA
ms
μA
pF
ns
ns
ns
μs
ns
ns
ns
ns
ns
ns
ns
ns
μs
μs
μs
V
V
V
V
V
V
V
Row Erase
Program
memory
Row Erase
Data EEPROM
Bulk Erase
I
I
To meet AC
specifications
ICSP™ mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
OL
OH
Conditions
= 8.5 mA
= -3.0 mA

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