DSPIC33FJ256GP710A-E/PF Microchip Technology, DSPIC33FJ256GP710A-E/PF Datasheet - Page 19
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DSPIC33FJ256GP710A-E/PF
Manufacturer Part Number
DSPIC33FJ256GP710A-E/PF
Description
IC DSPIC DSC 256K FLASH 100TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ64GP206-IPT.pdf
(322 pages)
2.DSPIC33FJ64GP206A-IMR.pdf
(338 pages)
3.DSPIC33FJ128GP306A-IPT.pdf
(350 pages)
Specifications of DSPIC33FJ256GP710A-E/PF
Program Memory Type
FLASH
Program Memory Size
256KB (256K x 8)
Package / Case
100-TQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Ram Size
30K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
85
Data Ram Size
30 KB
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240002, DM330011, DM300019, DV164033, MA330011, MA330012, DM300024
Minimum Operating Temperature
- 40 C
Package
100TQFP
Device Core
dsPIC
Family Name
dSPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
64-chx10-bit|64-chx12-bit
Number Of Timers
9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ256GP710A-E/PF
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
DSPIC33FJ256GP710A-E/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
- DSPIC33FJ64GP206-IPT PDF datasheet
- DSPIC33FJ64GP206A-IMR PDF datasheet #2
- DSPIC33FJ128GP306A-IPT PDF datasheet #3
- Current page: 19 of 322
- Download datasheet (5Mb)
2.0
2.1
Getting
dsPIC33FJXXXGPX06/X08/X10 family of 16-bit Digital
Signal Controllers (DSCs) requires attention to a
minimal set of device pin connections before
proceeding with development. The following is a list of
pin names, which must always be connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
• V
© 2009 Microchip Technology Inc.
Note:
(see Section 2.2 “Decoupling Capacitors”)
is not used)
(see Section 2.2 “Decoupling Capacitors”)
(see Section 2.3 “Capacitor on Internal Voltage
Regulator (V
(see Section 2.4 “Master Clear (MCLR) Pin”)
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
source is used
(see Section 2.6 “External Oscillator Pins”)
reference for ADC module is implemented
Note:
REF
CAP
DD
+/V
/V
DD
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS
Basic Connection Requirements
DDCORE
and V
REF
and AV
This data sheet summarizes the features
of the dsPIC33FJXXXGPX06/X08/X10
family of devices. It is not intended to be a
comprehensive
complement the information in this data
sheet, refer to the “dsPIC33F Family
Reference Manual”, which is available
from
(www.microchip.com).
The AV
connected independent of the ADC
voltage reference source.
- pins used when external voltage
CAP
SS
started
SS
pins
/V
DD
DDCORE
pins (regardless if ADC module
the
and AV
reference
)”)
Microchip
SS
with
dsPIC33FJXXXGPX06/X08/X10
pins must be
source.
website
To
the
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
• Placement on the printed circuit board: The
• Handling high frequency noise: If the board is
• Maximizing performance: On the board layout
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
SS
is required.
Decoupling Capacitors
DD
, V
DS70286C-page 17
SS
, AV
DD
and
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