PIC16F877-04I/PQ Microchip Technology, PIC16F877-04I/PQ Datasheet - Page 22
![IC MCU FLASH 8KX14 EE 44-MQFP](/photos/6/59/65984/150-44-pqfp_sml.jpg)
PIC16F877-04I/PQ
Manufacturer Part Number
PIC16F877-04I/PQ
Description
IC MCU FLASH 8KX14 EE 44-MQFP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16C770-ISO.pdf
(8 pages)
4.PIC16F873-04SO.pdf
(218 pages)
5.PIC16F873-04SO.pdf
(5 pages)
6.PIC16F873-04SO.pdf
(5 pages)
Specifications of PIC16F877-04I/PQ
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Program Memory Size
14KB (8K x 14)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
44-MQFP, 44-PQFP
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP, PSP, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
33
Number Of Timers
3 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
- 40 C
On-chip Adc
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F877-04I/PQ
Manufacturer:
MICROCHIP
Quantity:
1 000
Company:
Part Number:
PIC16F877-04I/PQ
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16C770-ISO PDF datasheet #3
- PIC16F873-04SO PDF datasheet #4
- PIC16F873-04SO PDF datasheet #5
- PIC16F873-04SO PDF datasheet #6
- Current page: 22 of 688
- Download datasheet (3Mb)
PICmicro MID-RANGE MCU FAMILY
1.5.3.4
1.5.3.5
1.5.3.6
1.5.3.7
DS31001A-page 1-10
UV Erasable Devices
One-Time-Programmable (OTP) Devices
Flash Devices
EEPROM Devices
The UV erasable version of EPROM program memory devices is optimal for prototype develop-
ment and pilot programs.
These devices can be erased and reprogrammed to any of the configuration modes. Third party
programmers are also available; refer to Microchip’s Third Party Guide (DS00104) for a list of
sources.
The amount of time required to completely erase a UV erasable device depends on: the wave-
length of the light, its intensity, distance from UV source, the process technology of the device
(how small are the memory cells).
The availability of OTP devices is especially useful for customers expecting code changes and
updates.
OTP devices, packaged in plastic packages, permit the user to program them once. In addition
to the program and data EPROM memories, the configuration bits must be programmed.
A Flash device allows its memory to be changed by an electric charge. This means that the sys-
tem can be designed so that programming may be performed in-circuit. Since no window is
required, the lower cost plastic packages can used for these devices.
An EEPROM device allows its memory to be erased by an electric charge. This means that the
system can be designed so that erasure and reprogramming may be performed in-circuit. Since
no window is required, the lower cost plastic packages can used for these devices.
Note:
Fluorescent lights and sunlight both emit ultraviolet light at the erasure wavelength.
Leaving a UV erasable device’s window uncovered could cause, over time, the
devices memory cells to become erased. The erasure time for a fluorescent light is
about three years, while sunlight requires only about one week. To prevent the mem-
ory cells from losing data, an opaque label should be placed over the erasure win-
dow.
1997 Microchip Technology Inc.
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