PIC24HJ64GP210-I/PF Microchip Technology, PIC24HJ64GP210-I/PF Datasheet - Page 277

• Manufacturer Part Number: PIC24HJ64GP210-I/PF
• Description: IC PIC MCU FLASH 32KX16 100TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ64GP210-I/PF

• Core Size: 16-Bit
• Program Memory Size: 64KB (22K x 24)
• Core Processor: PIC
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 85
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Controller Family/series: PIC24
• No. Of I/o's: 85
• Ram Memory Size: 8KB
• Cpu Speed: 40MIPS
• No. Of Timers: 13
• No. Of Pwm Channels: 8
• Embedded Interface Type: I2C, SPI, UART
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARDAC164333 - MODULE SKT FOR PM3 100QFPDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

100-Lead Plastic Thin-Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
© 2006 Microchip Technology Inc.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
JEDEC Equivalent: MS-026
Drawing No. C04-100
c
B
p
See ASME Y14.5M
See ASME Y14.5M
Dimension Limits
#leads=n1
E1
E
Units
A2
D1
n1
E1
A1
n
p
A
L
F
E
D
c
B
n
MIN
2
1
Preliminary
.039
.037
.002
.018
.004
.005
D1
0°
5°
5°
CH x 45°
.039 REF.
.016 BSC
.551 BSC
.551 BSC
.472 BSC
.472 BSC
L
D
INCHES
NOM
A
A1
.043
.039
.004
.024
.006
.007
3.5°
100
10°
10°
25
F
MAX
.047
.041
.006
.030
.008
.009
15°
15°
7°
MIN
1.00
0.95
0.05
0.45
0.09
0.13
0°
5°
5°
MILLIMETERS*
14.00 BSC
14.00 BSC
12.00 BSC
12.00 BSC
1.00 REF.
0.40 BSC
Revised 07-22-05
NOM
1.10
1.00
0.10
0.60
0.15
0.18
3.5°
100
10°
10°
25
PIC24H
A2
DS70175C-page 275
MAX
1.20
1.05
0.15
0.75
0.20
0.23
15°
15°
7°