PIC18F2580-I/SO Microchip Technology, PIC18F2580-I/SO Datasheet - Page 27
![IC PIC MCU FLASH 16KX16 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC18F2580-I/SO
Manufacturer Part Number
PIC18F2580-I/SO
Description
IC PIC MCU FLASH 16KX16 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18F2221-ISO.pdf
(46 pages)
2.PIC18F4480-IPT.pdf
(490 pages)
3.PIC18F4480-IPT.pdf
(8 pages)
4.PIC18F4480-IPT.pdf
(6 pages)
5.PIC18F4480-IPT.pdf
(6 pages)
6.PIC18F2580-ESO.pdf
(483 pages)
Specifications of PIC18F2580-I/SO
Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
SPI/I2C/EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163011, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F2580-I/SO
Manufacturer:
MICROCHIP
Quantity:
2 300
Part Number:
PIC18F2580-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC18F2221-ISO PDF datasheet
- PIC18F4480-IPT PDF datasheet #2
- PIC18F4480-IPT PDF datasheet #3
- PIC18F4480-IPT PDF datasheet #4
- PIC18F4480-IPT PDF datasheet #5
- PIC18F2580-ESO PDF datasheet #6
- Current page: 27 of 490
- Download datasheet (9Mb)
2.3
The
functions: Device Reset, and Device Programming
and Debugging. If programming and debugging are
not required in the end application, a direct
connection to V
addition of other components, to help increase the
application’s resistance to spurious Resets from
voltage
configuration is shown in Figure 2-1. Other circuit
designs may be implemented, depending on the
application’s requirements.
During programming and debugging, the resistance
and capacitance that can be added to the pin must be
considered. Device programmers and debuggers drive
the MCLR pin. Consequently, specific voltage levels
(V
adversely affected. Therefore, specific values of R1
and C1 will need to be adjusted based on the
application and PCB requirements. For example, it is
recommended that the capacitor, C1, be isolated from
the MCLR pin during programming and debugging
operations by using a jumper (Figure 2-2). The jumper
is replaced for normal run-time operations.
Any components associated with the MCLR pin
should be placed within 0.25 inch (6 mm) of the pin.
FIGURE 2-2:
© 2009 Microchip Technology Inc.
IH
Note 1: R1 ≤ 10 kΩ is recommended. A suggested
and V
MCLR
2: R2 ≤ 470Ω will limit any current flowing into
Master Clear (MCLR) Pin
sags,
IL
starting value is 10 kΩ. Ensure that the
MCLR pin V
MCLR from the external capacitor, C, in the
event of MCLR pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
V
V
) and fast signal transitions must not be
DD
IH
pin
R1
JP
C1
and V
DD
may
may be all that is required. The
provides
IL
EXAMPLE OF MCLR PIN
CONNECTIONS
specifications are met.
IH
R2
and V
be
MCLR
IL
beneficial.
PIC18FXXXX
two
specifications are met.
specific
A
PIC18F2480/2580/4480/4580
device
typical
2.4
The PGC and PGD pins are used for In-Circuit Serial
Programming™ (ICSP™) and debugging purposes. It
is recommended to keep the trace length between the
ICSP connector and the ICSP pins on the device as
short as possible. If the ICSP connector is expected to
experience an ESD event, a series resistor is recom-
mended, with the value in the range of a few tens of
ohms, not to exceed 100Ω.
Pull-up resistors, series diodes, and capacitors on the
PGC and PGD pins are not recommended as they will
interfere with the programmer/debugger communica-
tions to the device. If such discrete components are an
application requirement, they should be removed from
the circuit during programming and debugging. Alter-
natively, refer to the AC/DC characteristics and timing
requirements information in the respective device
Flash programming specification for information on
capacitive loading limits and pin input voltage high (V
and input low (V
For device emulation, ensure that the “Communication
Channel Select” (i.e., PGCx/PGDx pins) programmed
into the device matches the physical connections for
the ICSP to the Microchip debugger/emulator tool.
For
development tools connection requirements, refer to
Section 27.0 “Development Support”.
more
ICSP Pins
information
IL
) requirements.
on
available
DS39637D-page 27
Microchip
IH
)
Related parts for PIC18F2580-I/SO
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
![PIC18F258-I/SP](/photos/6/59/65908/150-28-dip_tmb.jpg)
Part Number:
Description:
IC MCU FLASH 16KX16 CAN 28DIP
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F258-I/SO](/photos/6/59/65909/150-28-soic_tmb.jpg)
Part Number:
Description:
IC MCU FLASH 16KX16 CAN 28SOIC
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F258](/images/no-image3.png)
Part Number:
Description:
High Performance, 28/40-Pin Enhanced FLASH Microcontrollers with CAN
Manufacturer:
MICROCHIP [Microchip Technology]
Datasheet:
![PIC18F258-I/SOG](/photos/6/59/65909/150-28-soic_tmb.jpg)
Part Number:
Description:
IC MCU FLASH 16KX16 28SOIC
Manufacturer:
Microchip Technology
![PIC18F258-E/SP](/photos/6/59/65908/150-28-dip_tmb.jpg)
Part Number:
Description:
IC MCU FLASH 16KX16 W/CAN 28DIP
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F258-E/SO](/photos/6/59/65909/150-28-soic_tmb.jpg)
Part Number:
Description:
IC MCU FLASH 16KX16 CAN 28-SOIC
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F6393T-I/PT](/photos/6/81/68123/c04-066_pf_tmb.jpg)
Part Number:
Description:
PIC18F With 128-segment LCD Driver And 12-bit ADC, 8KB Flash, 768B RAM, CCP, MSS
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F6493T-I/PT](/photos/6/81/68123/c04-066_pf_tmb.jpg)
Part Number:
Description:
PIC18F With 128-segment LCD Driver And 12-bit ADC, 16KB Flash, 768B RAM, CCP, MS
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F8393T-I/PT](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
PIC18F With 192-segment LCD Driver And 12-bit ADC, 8KB Flash, 768B RAM, CCP, MSS
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F8493T-I/PT](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
PIC18F With 192-segment LCD Driver And 12-bit ADC, 16KB Flash, 768B RAM, CCP, MS
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F6585-I/L](/photos/16/12/161282/68-plcc-large-300dpi-lyrd_tmb.jpg)
Part Number:
Description:
Microcontrollers (MCU) 48KB 3328 RAM 52 I/O
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F6680-I/L](/photos/16/12/161282/68-plcc-large-300dpi-lyrd_tmb.jpg)
Part Number:
Description:
Microcontrollers (MCU) 64KB 3328 RAM 52 I/O
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F65K90T-I/MR](/photos/16/3/160368/qfn64_tmb.jpg)
Part Number:
Description:
32kB Flash, 2kB RAM, 1kB EE, NanoWatt XLP, LCD 64 QFN 9x9x0.9mm T/R
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F65K90T-I/PT](/photos/16/3/160367/tqfp-64_tmb.jpg)
Part Number:
Description:
32kB Flash, 2kB RAM, 1kB EE, NanoWatt XLP, LCD 64 TQFP 10x10x1mm T/R
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F87K90T-I/PT](/photos/40/31/403173/tqfp-80_tmb.jpg)
Part Number:
Description:
128kB Flash, 4kB RAM, 1kB EE, 16MIPS, NanoWatt XLP, LCD, 5V 80 TQFP 12x12x1mm T/
Manufacturer:
Microchip Technology
Datasheet: