DSPIC33FJ256GP710-I/PF Microchip Technology, DSPIC33FJ256GP710-I/PF Datasheet - Page 149
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DSPIC33FJ256GP710-I/PF
Manufacturer Part Number
DSPIC33FJ256GP710-I/PF
Description
IC DSPIC MCU/DSP 256K 100TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ12GP201-ISO.pdf
(90 pages)
2.DSPIC33FJ64GP206-IPT.pdf
(322 pages)
3.DSPIC33FJ64GP206-IPT.pdf
(28 pages)
Specifications of DSPIC33FJ256GP710-I/PF
Program Memory Type
FLASH
Program Memory Size
256KB (256K x 8)
Package / Case
100-TQFP, 100-VQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Ram Size
30K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
85
Data Ram Size
30 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240002, DM330011, DM300019, DV164033, MA330011, MA330012, DM300024
Minimum Operating Temperature
- 40 C
Package
100TQFP
Device Core
dsPIC
Family Name
dsPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
64-chx10-bit|64-chx12-bit
Number Of Timers
9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1001 - DSPIC33 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1DV164033 - KIT START EXPLORER 16 MPLAB ICD2MA330012 - MODULE DSPIC33 100P TO 84QFPMA330011 - MODULE DSPIC33 100P TO 100QFPDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164323 - MODULE SKT FOR 100TQFP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ256GP710-I/PF
Manufacturer:
ISSI
Quantity:
101
Company:
Part Number:
DSPIC33FJ256GP710-I/PF
Manufacturer:
FREESCAL
Quantity:
150
Company:
Part Number:
DSPIC33FJ256GP710-I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC33FJ256GP710-I/PF
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
10.0
The dsPIC33FJXXXGPX06/X08/X10 devices provide
the ability to manage power consumption by selectively
managing clocking to the CPU and the peripherals. In
general, a lower clock frequency and a reduction in the
number of circuits being clocked constitutes lower
consumed
devices can manage power consumption in four
different ways:
• Clock frequency
• Instruction-based Sleep and Idle modes
• Software-controlled Doze mode
• Selective peripheral control in software
Combinations of these methods can be used to
selectively tailor an application’s power consumption
while still maintaining critical application features, such
as timing-sensitive communications.
10.1
dsPIC33FJXXXGPX06/X08/X10 devices allow a wide
range of clock frequencies to be selected under
application control. If the system clock configuration is
not
high-precision oscillators by simply changing the
NOSC bits (OSCCON<10:8>). The process of
changing a system clock during operation, as well as
limitations to the process, are discussed in more detail
in Section 9.0 “Oscillator Configuration”.
EXAMPLE 10-1:
© 2009 Microchip Technology Inc.
PWRSAV #SLEEP_MODE
PWRSAV #IDLE_MODE
Note:
locked,
POWER-SAVING FEATURES
Clock Frequency and Clock
Switching
This data sheet summarizes the features
of the dsPIC33FJXXXGPX06/X08/X10
family of devices. However, it is not
intended to be a comprehensive reference
source. To complement the information in
this data sheet, refer to Section 9.
“Watchdog Timer and Power-Saving
Modes” (DS70196) in the “dsPIC33F
Family Reference Manual”, which is avail-
able
(www.microchip.com).
power.
users
from
dsPIC33FJXXXGPX06/X08/X10
PWRSAV INSTRUCTION SYNTAX
can
the
; Put the device into SLEEP mode
; Put the device into IDLE mode
choose
Microchip
dsPIC33FJXXXGPX06/X08/X10
low-power
web
site
or
10.2
dsPIC33FJXXXGPX06/X08/X10 devices have two
special power-saving modes that are entered through
the execution of a special PWRSAV instruction. Sleep
mode stops clock operation and halts all code
execution. Idle mode halts the CPU and code
execution, but allows peripheral modules to continue
operation. The assembly syntax of the PWRSAV
instruction is shown in Example 10-1.
Sleep and Idle modes can be exited as a result of an
enabled interrupt, WDT time-out or a device Reset. When
the device exits these modes, it is said to “wake-up”.
10.2.1
Sleep mode has these features:
• The system clock source is shut down. If an
• The device current consumption is reduced to a
• The Fail-Safe Clock Monitor does not operate
• The LPRC clock continues to run in Sleep mode if
• The WDT, if enabled, is automatically cleared
• Some device features or peripherals may continue
The device will wake-up from Sleep mode on any of
these events:
• Any interrupt source that is individually enabled.
• Any form of device Reset.
• A WDT time-out.
On wake-up from Sleep, the processor restarts with the
same clock source that was active when Sleep mode
was entered.
on-chip oscillator is used, it is turned off.
minimum, provided that no I/O pin is sourcing
current.
during Sleep mode since the system clock source
is disabled.
the WDT is enabled.
prior to entering Sleep mode.
to operate in Sleep mode. This includes items such
as the input change notification on the I/O ports, or
peripherals that use an external clock input. Any
peripheral that requires the system clock source for
its operation is disabled in Sleep mode.
Note:
Instruction-Based Power-Saving
Modes
SLEEP MODE
SLEEP_MODE and IDLE_MODE are
constants defined in the assembler
include file for the selected device.
DS70286C-page 147