DSPIC33FJ256GP710-I/PF Microchip Technology, DSPIC33FJ256GP710-I/PF Datasheet - Page 260
![IC DSPIC MCU/DSP 256K 100TQFP](/photos/12/13/121330/c04-100-tqfp_sml.jpg)
DSPIC33FJ256GP710-I/PF
Manufacturer Part Number
DSPIC33FJ256GP710-I/PF
Description
IC DSPIC MCU/DSP 256K 100TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ12GP201-ISO.pdf
(90 pages)
2.DSPIC33FJ64GP206-IPT.pdf
(322 pages)
3.DSPIC33FJ64GP206-IPT.pdf
(28 pages)
Specifications of DSPIC33FJ256GP710-I/PF
Program Memory Type
FLASH
Program Memory Size
256KB (256K x 8)
Package / Case
100-TQFP, 100-VQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Ram Size
30K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
85
Data Ram Size
30 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240002, DM330011, DM300019, DV164033, MA330011, MA330012, DM300024
Minimum Operating Temperature
- 40 C
Package
100TQFP
Device Core
dsPIC
Family Name
dsPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
64-chx10-bit|64-chx12-bit
Number Of Timers
9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1001 - DSPIC33 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1DV164033 - KIT START EXPLORER 16 MPLAB ICD2MA330012 - MODULE DSPIC33 100P TO 84QFPMA330011 - MODULE DSPIC33 100P TO 100QFPDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164323 - MODULE SKT FOR 100TQFP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ256GP710-I/PF
Manufacturer:
ISSI
Quantity:
101
Company:
Part Number:
DSPIC33FJ256GP710-I/PF
Manufacturer:
FREESCAL
Quantity:
150
Company:
Part Number:
DSPIC33FJ256GP710-I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC33FJ256GP710-I/PF
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- DSPIC33FJ12GP201-ISO PDF datasheet
- DSPIC33FJ64GP206-IPT PDF datasheet #2
- DSPIC33FJ64GP206-IPT PDF datasheet #3
- Current page: 260 of 322
- Download datasheet (5Mb)
dsPIC33FJXXXGPX06/X08/X10
25.1
TABLE 25-1:
TABLE 25-2:
TABLE 25-3:
DS70286C-page 258
DC5
dsPIC33FJXXXGPX06/X08/X10
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 100-pin TQFP (14x14x1 mm)
Package Thermal Resistance, 100-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)
Note 1:
Characteristic
Operating Junction Temperature Range
DC Characteristics
P
I/O =
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
({V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
- V
V
DD
(in Volts)
DD
3.0-3.6V
OH
Characteristic
-
Range
} x I
I
Rating
OH
OH
)
) +
(V
OL
x I
OL
)
-40°C to +85°C
Temp Range
(in °C)
JA
(
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
P
T
T
JA
JA
JA
JA
A
D
J
dsPIC33FJXXXGPX06/X08/X10
Min
Typ
-40
-40
40
40
40
40
(T
© 2009 Microchip Technology Inc.
P
INT
J
- T
Max
Typ
Max MIPS
—
—
—
—
—
—
+ P
A
)/
40
I
/
JA
O
°C/W
°C/W
°C/W
°C/W
+125
Max
Unit
+85
Notes
Unit
°C
°C
W
W
1
1
1
1
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