PIC18F8622-I/PT Microchip Technology, PIC18F8622-I/PT Datasheet - Page 245
PIC18F8622-I/PT
Manufacturer Part Number
PIC18F8622-I/PT
Description
IC PIC MCU FLASH 32KX16 80TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.DV164136.pdf
(446 pages)
3.PIC18F8627T-IPT.pdf
(44 pages)
4.PIC18F6527-IPT.pdf
(10 pages)
5.PIC18F8622-IPT.pdf
(448 pages)
Specifications of PIC18F8622-I/PT
Program Memory Type
FLASH
Program Memory Size
64KB (32K x 16)
Package / Case
80-TFQFP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
EBI/EMI, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
70
Eeprom Size
1K x 8
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3936 B
Interface Type
SPI/I2C/EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
70
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183032
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F8622-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F8622-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- DV164136 PDF datasheet #2
- PIC18F8627T-IPT PDF datasheet #3
- PIC18F6527-IPT PDF datasheet #4
- PIC18F8622-IPT PDF datasheet #5
- Current page: 245 of 446
- Download datasheet (7Mb)
19.4.17.2
During a Repeated Start condition, a bus collision
occurs if:
a)
b)
When the user deasserts SDAx and the pin is allowed
to float high, the BRG is loaded with SSPxADD<6:0>
and counts down to ‘0’. The SCLx pin is then
deasserted and when sampled high, the SDAx pin is
sampled.
FIGURE 19-29:
FIGURE 19-30:
© 2008 Microchip Technology Inc.
A low level is sampled on SDAx when SCLx
goes from low level to high level.
SCLx goes low before SDAx is asserted low,
indicating that another master is attempting to
transmit a data ‘1’.
SDAx
SCLx
BCLxIF
RSEN
S
SSPxIF
SDAx
SCLx
RSEN
BCLxIF
S
SSPxIF
Bus Collision During a Repeated
Start Condition
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SCLx goes low before SDAx,
set BCLxIF. Release SDAx and SCLx.
T
BRG
Sample SDAx when SCLx goes high.
If SDAx = 0, set BCLxIF and release SDAx and SCLx.
If SDAx is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’, Figure 19-29).
If SDAx is sampled high, the BRG is reloaded and
begins counting. If SDAx goes from high-to-low before
the BRG times out, no bus collision occurs because no
two masters can assert SDAx at exactly the same time.
If SCLx goes from high-to-low before the BRG times
out and SDAx has not already been asserted, a bus
collision occurs. In this case, another master is
attempting to transmit a data ‘1’ during the Repeated
Start condition (see Figure 19-30).
If, at the end of the BRG time-out, both SCLx and SDAx
are still high, the SDAx pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCLx pin, the SCLx pin is
driven low and the Repeated Start condition is complete.
PIC18F8722 FAMILY
Cleared in software
T
BRG
Interrupt cleared
in software
‘0’
‘0’
DS39646C-page 243
‘0’
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