LPC1768FBD100,551 NXP Semiconductors, LPC1768FBD100,551 Datasheet - Page 36

IC ARM CORTEX MCU 512K 100-LQFP

LPC1768FBD100,551

Manufacturer Part Number
LPC1768FBD100,551
Description
IC ARM CORTEX MCU 512K 100-LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheets

Specifications of LPC1768FBD100,551

Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
100-LQFP
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
70
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC17
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN, I2C, SPI, UART
Maximum Clock Frequency
100 MHz
Number Of Programmable I/os
70
Number Of Timers
3
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB1760, MCB1760U, MCB1760UME, IRD-LPC1768-DEV, KSK-LPC1768-JL
Development Tools By Supplier
OM11032, OM11033, OM11034, OM11035, OM11043
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
On-chip Dac
10 bit
Package
100LQFP
Device Core
ARM Cortex M3
Family Name
LPC17xx
Maximum Speed
100 MHz
Cpu Family
LPC17xx
Device Core Size
32b
Frequency (max)
100MHz
Total Internal Ram Size
64KB
# I/os (max)
70
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2.4V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4916 - DEVELOPMENT BOARD LPC1768 MBED568-4816 - EVAL BOARD FOR MCB1768568-4815 - KIT EVAL LPC1768 CR622-1032 - KIT DEV IND REF DESIGN LPC1768622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4796
935288608551

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NXP Semiconductors
LPC1769_68_67_66_65_64_63
Product data sheet
7.29.6.1 Sleep mode
7.29.6.2 Deep-sleep mode
7.29.6 Power control
whenever any of the aforementioned functions are turned off for any reason. Since the
oscillator and other functions are turned off during Power-down mode, any wake-up of the
processor from Power-down mode makes use of the wake-up timer.
The Wake-up Timer monitors the crystal oscillator to check whether it is safe to begin
code execution. When power is applied to the chip, or when some event caused the chip
to exit Power-down mode, some time is required for the oscillator to produce a signal of
sufficient amplitude to drive the clock logic. The amount of time depends on many factors,
including the rate of V
electrical characteristics (if a quartz crystal is used), as well as any other external circuitry
(e.g., capacitors), and the characteristics of the oscillator itself under the existing ambient
conditions.
The LPC17xx support a variety of power control features. There are four special modes of
processor power reduction: Sleep mode, Deep-sleep mode, Power-down mode, and
Deep power-down mode. The CPU clock rate may also be controlled as needed by
changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider
value. This allows a trade-off of power versus processing speed based on application
requirements. In addition, Peripheral Power Control allows shutting down the clocks to
individual on-chip peripherals, allowing fine tuning of power consumption by eliminating all
dynamic power use in any peripherals that are not required for the application. Each of the
peripherals has its own clock divider which provides even better power control.
Integrated PMU (Power Management Unit) automatically adjust internal regulators to
minimize power consumption during Sleep, Deep sleep, Power-down, and Deep
power-down modes.
The LPC17xx also implement a separate power domain to allow turning off power to the
bulk of the device while maintaining operation of the RTC and a small set of registers for
storing data during any of the power-down modes.
When Sleep mode is entered, the clock to the core is stopped. Resumption from the Sleep
mode does not need any special sequence but re-enabling the clock to the ARM core.
In Sleep mode, execution of instructions is suspended until either a Reset or interrupt
occurs. Peripheral functions continue operation during Sleep mode and may generate
interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic
power used by the processor itself, memory systems and related controllers, and internal
buses.
In Deep-sleep mode, the oscillator is shut down and the chip receives no internal clocks.
The processor state and registers, peripheral registers, and internal SRAM values are
preserved throughout Deep-sleep mode and the logic levels of chip pins remain static.
The output of the IRC is disabled but the IRC is not powered down for a fast wake-up later.
The RTC oscillator is not stopped because the RTC interrupts may be used as the
wake-up source. The PLL is automatically turned off and disconnected. The CCLK and
USB clock dividers automatically get reset to zero.
All information provided in this document is subject to legal disclaimers.
DD(3V3)
Rev. 6.01 — 11 March 2011
ramp (in the case of power on), the type of crystal and its
LPC1769/68/67/66/65/64/63
32-bit ARM Cortex-M3 microcontroller
© NXP B.V. 2011. All rights reserved.
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