STM8S103F3P6 STMicroelectronics, STM8S103F3P6 Datasheet - Page 93

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STM8S103F3P6

Manufacturer Part Number
STM8S103F3P6
Description
MCU 8BIT 8KB FLASH 20-TSSOP
Manufacturer
STMicroelectronics
Series
STM8Sr
Datasheet

Specifications of STM8S103F3P6

Core Processor
STM8
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Eeprom Size
640 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.95 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-TSSOP
Processor Series
STM8S10x
Core
STM8
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
16
Number Of Timers
7
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWSTM8
Development Tools By Supplier
STM8/128-MCKIT, STM8S-DISCOVERY, ST-LINK, STICE-SYS001, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 5 Channel
Featured Product
STM32 Cortex-M3 Companion Products
For Use With
497-10593 - KIT STARTER FOR STM8S207/8 SER
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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STM8S103K3 STM8S103F3 STM8S103F2
11.2
32-lead UFQFPN package mechanical data
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended
4. Dimensions are in millimeters.
Dim.
A
A1
A3
Table 53: 32-lead, ultra thin, fine pitch quad flat no-lead package mechanical data
life.
to connect and solder this backside pad to PCB ground.
Figure 46: 32-lead, ultra thin, fine pitch quad flat no-lead package (5 x 5)
mm
Min
0.500
0
Typ
0.550
0.020
0.200
DocID15441 Rev 6
Max
0.600
0.050
inches
Min
0.0197
(1)
Typ
0.0217
0.0008
0.0079
Package information
AOB8_ME
Max
0.0236
0.0020
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