STM32F101ZDT6 STMicroelectronics, STM32F101ZDT6 Datasheet - Page 89
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STM32F101ZDT6
Manufacturer Part Number
STM32F101ZDT6
Description
MCU ARM 32BIT 384K FLASH 144LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F101RET6.pdf
(106 pages)
Specifications of STM32F101ZDT6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
112
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
48 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
112
Number Of Timers
6
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
On-chip Dac
12 bit, 2 Channel
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
For Use With
497-10030 - STARTER KIT FOR STM32KSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8505 - KIT STARTER FOR STM32F10XE MCU497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F101ZDT6
Manufacturer:
STM
Quantity:
243
Company:
Part Number:
STM32F101ZDT6
Manufacturer:
STMicroelectronics
Quantity:
10 000
STM32F101xC, STM32F101xD, STM32F101xE
Table 56.
1. ADC DC accuracy values are measured after internal calibration.
2. Better performance could be achieved in restricted V
3. ADC accuracy vs. negative injection current: Injecting negative current on any of the standard (non-robust)
4. Based on characterization, not tested in production.
Figure 45. ADC accuracy characteristics
Symbol
4095
4094
4093
analog input pins should be avoided as this significantly reduces the accuracy of the conversion being
performed on another analog input. It is recommended to add a Schottky diode (pin to ground) to standard
analog pins which may potentially inject negative current.
Any positive injection current within the limits specified for I
affect the ADC accuracy.
EO
EG
ED
ET
EL
7
6
5
4
3
2
1
0
V
SSA
[1LSB
1
E
Total unadjusted error
Offset error
Gain error
Differential linearity error
Integral linearity error
IDEAL
O
ADC accuracy
2
=
V
4096
3
REF+
Parameter
4
(or
V
5
1 LSB
4096
DDA
E
(1) (2)(3)
6
T
depending on package)]
IDEAL
Doc ID 14610 Rev 7
E
7
L
(2)
f
f
V
Measurements made after
ADC calibration
E
PCLK2
ADC
DDA
D
4093 4094 4095 4096
(3)
= 14 MHz, R
= 2.4 V to 3.6 V
= 28 MHz,
Test conditions
DD
(1)
, frequency, V
E
INJ(PIN)
G
V
AIN
DDA
and I
< 10 k,
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
E
between the actual and the ideal transfer curves.
E
transition and the first ideal one.
E
transition and the last actual one.
E
between actual steps and the ideal one.
E
between any actual transition and the end point
correlation line.
T
O
G
D
L
=Total Unadjusted Error: maximum deviation
=Integral Linearity Error: maximum deviation
REF
=Differential Linearity Error: maximum deviation
=Offset Error: deviation between the first actual
=Gain Error: deviation between the last ideal
INJ(PIN)
and temperature ranges.
Electrical characteristics
in
±1.5
±1.5
±1.5
Typ
±2
±1
Section 5.3.13
Max
±2.5
±3
±2
±5
±3
(4)
does not
89/106
Unit
LSB
ai14395b