S9S08SG4E2MTJ Freescale Semiconductor, S9S08SG4E2MTJ Datasheet - Page 287
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S9S08SG4E2MTJ
Manufacturer Part Number
S9S08SG4E2MTJ
Description
MCU 4K FLASH 20-TSSOP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.S9S08SG4E2CSC.pdf
(316 pages)
Specifications of S9S08SG4E2MTJ
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
16
Program Memory Size
4KB (4K x 8)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
20-TSSOP
Processor Series
S08SG
Core
HCS08
Data Bus Width
8 bit
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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A.4
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take P
voltage and V
pin current (heavy loads), the difference between pin voltage and V
Freescale Semiconductor
1
2
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board,
and board thermal resistance.
Junction to Ambient Natural Convection
Num
Thermal Characteristics
1
2
3
4
SS
or V
—
D
D
D
C
DD
I/O
Operating temperature range (packaged)
Maximum junction temperature
Thermal resistance
Thermal resistance
and multiply by the pin current for each I/O pin. Except in cases of unusually high
into account in power calculations, determine the difference between actual pin
Single-layer board
Four-layer board
MC9S08SG8 MCU Series Data Sheet, Rev. 6
Table A-3. Thermal Characteristics
Rating
1,2
1,2
8-pin NB SOIC
8-pin NB SOIC
16-pin TSSOP
20-pin TSSOP
16-pin TSSOP
20-pin TSSOP
M
M
C
C
V
V
Symbol
θ
θ
T
T
JA
JA
A
J
SS
or V
DD
Appendix A Electrical Characteristics
–40 to 105
–40 to 125
–40 to 85
T
will be very small.
L
Value
115
135
167
123
115
115
95
75
76
to T
H
°C/W
°C/W
Unit
°C
°C
287
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