S9S08SG16E1VTJ Freescale Semiconductor, S9S08SG16E1VTJ Datasheet - Page 272
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S9S08SG16E1VTJ
Manufacturer Part Number
S9S08SG16E1VTJ
Description
MCU 16K FLASH 20-TSSOP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.S9S08SG16E1CTG.pdf
(330 pages)
Specifications of S9S08SG16E1VTJ
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
16
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
20-TSSOP
Processor Series
S08SG
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
I2C, SPI, SCI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
22
Number Of Timers
2
Operating Supply Voltage
- 0.3 V to + 5.8 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
On-chip Dac
10 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
S9S08SG16E1VTJ SG16SVTJ
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
S9S08SG16E1VTJR
Manufacturer:
FREESCALE
Quantity:
20 000
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Chapter 17 Development Support
When no debugger pod is connected to the 6-pin BDM interface connector, the internal pullup on BKGD
chooses normal operating mode. When a debug pod is connected to BKGD it is possible to force the MCU
into active background mode after reset. The specific conditions for forcing active background depend
upon the HCS08 derivative (refer to the introduction to this Development Support section). It is not
necessary to reset the target MCU to communicate with it through the background debug interface.
17.2.2
Communication Details
The BDC serial interface requires the external controller to generate a falling edge on the BKGD pin to
indicate the start of each bit time. The external controller provides this falling edge whether data is
transmitted or received.
BKGD is a pseudo-open-drain pin that can be driven either by an external controller or by the MCU. Data
is transferred MSB first at 16 BDC clock cycles per bit (nominal speed). The interface times out if
512 BDC clock cycles occur between falling edges from the host. Any BDC command that was in progress
when this timeout occurs is aborted without affecting the memory or operating mode of the target MCU
system.
The custom serial protocol requires the debug pod to know the target BDC communication clock speed.
The clock switch (CLKSW) control bit in the BDC status and control register allows the user to select the
BDC clock source. The BDC clock source can either be the bus or the alternate BDC clock source.
The BKGD pin can receive a high or low level or transmit a high or low level. The following diagrams
show timing for each of these cases. Interface timing is synchronous to clocks in the target BDC, but
asynchronous to the external host. The internal BDC clock signal is shown for reference in counting cycles.
MC9S08SG32 Data Sheet, Rev. 8
272
Freescale Semiconductor
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