MC9S08AC32MFDE Freescale Semiconductor, MC9S08AC32MFDE Datasheet - Page 329
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MC9S08AC32MFDE
Manufacturer Part Number
MC9S08AC32MFDE
Description
MCU 8BIT 32K FLASH 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.MC9S08AC60CFJE.pdf
(348 pages)
Specifications of MC9S08AC32MFDE
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
38
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
48-QFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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Appendix B
Ordering Information and Mechanical Drawings
B.1
This section contains ordering numbers for MC9S08AC60 Series devices. See below for an example of the
device numbering system.
B.2
B.3
This following pages contain mechanical specifications for MC9S08AC60 Series package options. See
Table B-2
Freescale Semiconductor
Ordering Information
Orderable Part Numbering System
Mechanical Drawings
for the document numbers that correspond to each package type.
1
2
(MC = Fully Qualified)
See
See
(9 = FLASH-based)
Device Number
Table 1-1
Table B-2
MC9S08AC60
MC9S08AC48
MC9S08AC32
Pin Count
Memory
Status
Family
64
64
48
for a complete description of modules included on each device.
for package information.
Core
1
Table B-1. Device Numbering System
MC 9 S08 AC
MC9S08AC60 Series Data Sheet, Rev. 2
LQFP
Type
QFN
QFP
Table B-2. Package Information
63,280
49,152
32,768
Flash
Designator
60
Memory
PU
FU
FD
C XX E
2048
RAM
Temperature range
(C = –40°C to 85°C)
(M = –40°C to 125°C)
Approximate memory size (in KB)
Pb free indicator
Package designator
98ASS23234W
Document No.
98ARH99048A
98ASB42844B
48 QFN, 44 LQFP, 32 LQFP
48 QFN, 44 LQFP, 32 LQFP
48 QFN, 44 LQFP, 32 LQFP
Available Packages
64 LQFP, 64 QFP
64 LQFP, 64 QFP
64 LQFP, 64 QFP
Type
(See
Table
B-2)
2
329
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