MC9S08GT8ACFBE Freescale Semiconductor, MC9S08GT8ACFBE Datasheet - Page 261

• Manufacturer Part Number: MC9S08GT8ACFBE
• Description: IC MCU 8K FLASH 1K RAM 44-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08GT8ACFBE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFP
• Processor Series: S08GT
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 36
• Operating Supply Voltage: 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: M68EVB908GB60E, M68DEMO908GB60E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• For Use With: M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving equations 1 and 2 for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring
P
solving equations 1 and 2 iteratively for any value of T
Freescale Semiconductor
D
(at equilibrium) for a known T
I/O
T
θ
P
P
P
JA
D
int
I/O
A
is neglected) is:
= Ambient temperature, °C
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
= Power dissipation on input and output pins — user determined
int
DD
+ P
× V
1
2
I/O
Operating temperature range
(packaged)
Thermal resistance
Thermal resistance
Junction temperature is a function of die size, on-chip power dissipation, package
thermal resistance, mounting site (board) temperature, ambient temperature, airflow,
power dissipation of other components on the board, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Single layer board is designed per JEDEC JESD51-3.
DD
1s board type
2s2p board type
, Watts — chip internal power
I/O
48-pin QFN
44-pin QFP
42-pin SDIP
32-pin QFN
48-pin QFN
44-pin QFP
42-pin SDIP
32-pin QFN
<< P
Rating
K = P
int
A
and can be neglected. An approximate relationship between P
MC9S08GT16A/GT8A Data Sheet, Rev. 1
. Using this value of K, the values of P
Table A-3. Thermal Characteristics
D
P
T
× (T
D
J
= K ÷ (T
J
= T
A
) in °C can be obtained from:
+ 273°C) + θ
A
+ (P
J
D
+ 273°C)
× θ
Symbol
θ
θ
JA
A
JA
JA
T
JA
.
A
1, 2
1,2
)
× (P
D
)
2
–40 to 125
T
Value
L
84
72
62
99
26
54
51
33
to T
H
D
and T
J
°C/W
°C/W
Unit
can be obtained by
°C
Electrical Characteristics
D
Eqn. A-1
Eqn. A-2
Eqn. A-3
and T
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J