MC9S08DN60AMLF Freescale Semiconductor, MC9S08DN60AMLF Datasheet - Page 311
![IC MCU 60K FLASH 2K RAM 48-LQFP](/photos/12/35/123547/mc9s08dn60aclf_sml.jpg)
MC9S08DN60AMLF
Manufacturer Part Number
MC9S08DN60AMLF
Description
IC MCU 60K FLASH 2K RAM 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Specifications of MC9S08DN60AMLF
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
48-LQFP
Processor Series
S08DN
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
I2C, SCI, SPI
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08DZ60
On-chip Adc
12 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08DN60AMLF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving equations 1 and 2 for K gives:
Freescale Semiconductor
1
2
I/O
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Junction to Ambient Natural Convection
Num
1
2
3
is neglected) is:
T
θ
P
P
P
C
D
T
D
JA
A
D
int
I/O
= Ambient temperature, °C
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
Operating temperature range (packaged)
Maximum Junction Temperature
Thermal resistance
= Power dissipation on input and output pins — user determined
int
DD
+ P
Single-layer board
Four-Layer board
× V
I/O
I/O
DD
<< P
, Watts — chip internal power
K = P
2
int
Rating
and can be neglected. An approximate relationship between P
MC9S08DN60 Series Data Sheet, Rev 3
Table A-3. Thermal Characteristics
D
P
T
× (T
D
J
= K ÷ (T
J
= T
A
1
) in °C can be obtained from:
64-pin LQFP
48-pin LQFP
32-pin LQFP
64-pin LQFP
48-pin LQFP
32-pin LQFP
+ 273°C) + θ
A
+ (P
J
D
+ 273°C)
× θ
JA
JA
)
Symbol
× (P
θ
θ
θ
θ
θ
θ
T
T
JA
JA
JA
JA
JA
JA
A
J
D
)
2
–40 to 125
–40 to 105
–40 to 85
Value
135
Appendix A Electrical Characteristics
69
75
80
51
51
52
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C
°C
Temp.
Code
D
Eqn. A-1
Eqn. A-2
Eqn. A-3
—
M
C
V
and T
311
J
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