C8051F704-GQ Silicon Laboratories Inc, C8051F704-GQ Datasheet - Page 38
![IC 8051 MCU 15K FLASH 48-TQFP](/photos/12/36/123601/c8051f704-gq_sml.jpg)
C8051F704-GQ
Manufacturer Part Number
C8051F704-GQ
Description
IC 8051 MCU 15K FLASH 48-TQFP
Manufacturer
Silicon Laboratories Inc
Series
C8051F70xr
Specifications of C8051F704-GQ
Program Memory Type
FLASH
Program Memory Size
15KB (15K x 8)
Package / Case
48-TQFP, 48-VQFP
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
Cap Sense, POR, PWM, Temp Sensor, WDT
Number Of I /o
39
Eeprom Size
32 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F7x
Core
8051
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
39
Number Of Timers
4 x 16 bit
Operating Supply Voltage
1.8 V to 3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F700DK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
336-1635 - DEV KIT FOR C8051F700
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1611
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C8051F704-GQ
Manufacturer:
SILICON
Quantity:
890
Company:
Part Number:
C8051F704-GQ
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Company:
Part Number:
C8051F704-GQR
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
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- Download datasheet (2Mb)
C8051F70x/71x
38
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
pad is to be 60 m minimum, all the way around the pad.
solder paste release.
Components.
Dimension
C1
C2
E
X
Y
Table 4.2. TQFP-64 PCB Land Pattern Dimensions
Figure 4.2. TQFP-64 PCB Land Pattern
Rev. 1.0
11.30
11.30
0.20
1.40
Min
0.50 BSC
11.40
11.40
Max
0.30
1.50
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