MCF52231CAF60 Freescale Semiconductor, MCF52231CAF60 Datasheet - Page 8

• Manufacturer Part Number: MCF52231CAF60
• Description: IC MCU 32BIT 128K FLASH 80-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCF5223xr

Specifications of MCF52231CAF60

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 60MHz
• Connectivity: CAN, Ethernet, I²C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 73
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-LQFP
• Processor Series: MCF522x
• Core: ColdFire V2
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: I2C/QSPI/UART
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 56
• Number Of Timers: 10
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: M52235EVB, M52233DEMO
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 12-bit
• Controller Family/series: ColdFire
• No. Of I/o's: 43
• Ram Memory Size: 16KB
• Cpu Speed: 60MHz
• No. Of Timers: 1
• Embedded Interface Type: CAN, I2C, UART
• Rohs Compliant: Yes
• Package: 80LQFP
• Device Core: ColdFire
• Family Name: MCF5223x
• Maximum Speed: 60 MHz
• Operating Supply Voltage: 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MCF52235 Family Configurations
1.2.2
The version 2 ColdFire processor core is comprised of two separate pipelines decoupled by an instruction buffer. The two-stage
instruction fetch pipeline (IFP) is responsible for instruction-address generation and instruction fetch. The instruction buffer is
a first-in-first-out (FIFO) buffer that holds prefetched instructions awaiting execution in the operand execution pipeline (OEP).
The OEP includes two pipeline stages. The first stage decodes instructions and selects operands (DSOC); the second stage
(AGEX) performs instruction execution and calculates operand effective addresses, if needed.
The V2 core implements the ColdFire instruction set architecture revision A+ with added support for a separate user stack
pointer register and four new instructions to assist in bit processing. Additionally, the MCF52235 core includes the enhanced
multiply-accumulate (EMAC) unit for improved signal processing capabilities. The EMAC implements a three-stage arithmetic
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— Unique vector number for each interrupt source
— Ability to mask any individual interrupt source or all interrupt sources (global mask-all)
— Support for hardware and software interrupt acknowledge (IACK) cycles
— Combinatorial path to provide wake-up from low power modes
DMA controller
— Four fully programmable channels
— Dual-address transfer support with 8-, 16-, and 32-bit data capability, along with support for 16-byte (4 x 32-bit)
— Source/destination address pointers that can increment or remain constant
— 24-bit byte transfer counter per channel
— Auto-alignment transfers supported for efficient block movement
— Bursting and cycle steal support
— Software-programmable DMA requesters for the UARTs (3) and 32-bit timers (4)
Reset
— Separate reset in and reset out signals
— Seven sources of reset:
— Status flag indication of source of last reset
Chip integration module (CIM)
— System configuration during reset
— Selects one of three clock modes
— Configures output pad drive strength
— Unique part identification number and part revision number
General purpose I/O interface
— Up to 56 bits of general purpose I/O
— Bit manipulation supported via set/clear functions
— Programmable drive strengths
— Unused peripheral pins may be used as extra GPIO
JTAG support for system level board testing
burst transfers
– Power-on reset (POR)
– External
– Software
– Watchdog
– Loss of clock
– Loss of lock
– Low-voltage detection (LVD)
V2 Core Overview
MCF52235 ColdFire Microcontroller Data Sheet, Rev. 10
Freescale Semiconductor