MCF5328CVM240J Freescale Semiconductor, MCF5328CVM240J Datasheet - Page 46

• Manufacturer Part Number: MCF5328CVM240J
• Description: IC MPU RISC 240MHZ 256MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF532xr

Specifications of MCF5328CVM240J

• Core Processor: Coldfire V3
• Core Size: 32-Bit
• Speed: 240MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG
• Peripherals: DMA, LCD, PWM, WDT
• Number Of I /o: 94
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-MAPBGA
• Family Name: MPC5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 240MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8/2.5/3.3V
• Operating Supply Voltage (max): 1.6/1.95/2.75/3.6V
• Operating Supply Voltage (min): 1.4/1.7/2.25/3V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 256
• Package Type: MA-BGA
• Processor Series: MCF532xx
• Core: ColdFire V3
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Peak Reflow Compatible (260 C): Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

Package Information
7.2
Figure 37
46
196X
13X
3
e
X
E
shows the MCF5327CVM240 package dimensions.
Y
b
0.30
0.10 Z
S
Package Dimensions—196 MAPBGA
0.20
Z
14 13 12 11
X
Y
Laser mark for pin 1
identification in
this area
Figure 37. 196 MAPBGA Package Dimensions (Case No. 1128A-01)
10
Bottom View
Top View
9
View M-M
MCF532x ColdFire
D
6
13X
S
5
e
4
3
2
®
1
Microprocessor Data Sheet, Rev. 5
A
B
C
D
G
H
K
M
N
E
F
J
L
P
Metalized mark for
pin 1 identification
in this area
K
M
M
A
A2
A1
Rotated 90 Clockwise
NOTES:
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances
3. Dimension B is measured at the
4. Datum Z (seating plane) is defined
5. Parallelism measurement shall
per ASME Y14.5M, 1994.
maximum solder ball diameter,
parallel to datum plane Z.
by the spherical crowns of the solder
balls.
exclude any effect of mark on top
surface of package.
Z
DIM
A1 0.27 0.47
A2 1.18 REF
Detail K
A 1.32 1.75
D 15.00 BSC
b 0.35 0.65
E 15.00 BSC
e
S
4
°
Min Max
Millimeters
1.00 BSC
0.50 BSC
Freescale Semiconductor
0.15 Z
0.30 Z
5