HD64F3687GFP Renesas Electronics America, HD64F3687GFP Datasheet - Page 108

IC H8 MCU FLASH 56K 64-LQFP

HD64F3687GFP

Manufacturer Part Number
HD64F3687GFP
Description
IC H8 MCU FLASH 56K 64-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet

Specifications of HD64F3687GFP

Core Processor
H8/300H
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
45
Program Memory Size
56KB (56K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
64-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Section 5 Clock Pulse Generators
5.4
5.4.1
Resonator characteristics are closely related to board design and should be carefully evaluated by
the user, referring to the examples shown in this section. Resonator circuit constants will differ
depending on the resonator element, stray capacitance in its interconnecting circuit, and other
factors. Suitable constants should be determined in consultation with the resonator element
manufacturer. Design the circuit so that the resonator element never receives voltages exceeding
its maximum rating.
5.4.2
When using a crystal resonator (ceramic resonator), place the resonator and its load capacitors as
close as possible to the OSC
resonator circuit to prevent induction from interfering with correct oscillation (see figure 5.11).
Rev.5.00 Nov. 02, 2005 Page 74 of 500
REJ09B0027-0500
Usage Notes
Note on Resonators
Notes on Board Design
Figure 5.11 Example of Incorrect Board Design
1
Avoid
and OSC
OSC
OSC
2
pins. Other signal lines should be routed away from the
1
2
Signal A
Signal B
C
C
1
2

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