DF36034GFPJV Renesas Electronics America, DF36034GFPJV Datasheet - Page 504
![MCU 3/5V 32K J TEMP PB-FREE 64LQ](/photos/28/61/286100/64-lqfp__plqp0064kb-a_sml.jpg)
DF36034GFPJV
Manufacturer Part Number
DF36034GFPJV
Description
MCU 3/5V 32K J TEMP PB-FREE 64LQ
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Specifications of DF36034GFPJV
Core Processor
H8/300H
Core Size
16-Bit
Speed
20MHz
Connectivity
CAN, SCI, SSU
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
45
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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Section 22 Electrical Characteristics
22.3.3
Table 22.14 AC Characteristics
V
(wide-range specifications), unless otherwise indicated.
Rev. 4.00 Mar. 15, 2006 Page 470 of 556
REJ09B0026-0400
Item
System clock
oscillation
frequency
System clock ( )
cycle time
Subclock oscillator
oscillation
frequency
Subclock oscillator
( w) cycle time
Subclock ( sub)
cycle time
Instruction cycle
time
Oscillation
stabilization time
(crystal resonator)
Oscillation
stabilization time
(ceramic resonator)
External clock high
width
External clock low
width
External clock rise
time
External clock fall
time
CC
= 2.7 to 5.5 V, V
AC Characteristics
Symbol
f
t
f
t
t
t
t
t
t
t
t
OSC
cyc
RO
RO
subcyc
rc
rc
CPH
CPL
CPr
CPf
SS
= 0.0 V, T
Applicable
Pins
OSC1,
OSC2
OSC1,
OSC2
OSC1,
OSC2
OSC1
OSC1
OSC1
OSC1
a
= –20 to +75°C (regular specifications) or T
Test Condition
VCC = 4.0 to 5.5 V
V
V
V
V
V
V
V
CC
CC
CC
CC
CC
CC
CC
= 4.0 to 5.5 V
= 4.0 to 5.5 V
= 4.0 to 5.5 V
= 4.0 to 5.5 V
= 4.0 to 5.5 V
= 4.0 to 5.5 V
= 4.0 to 5.5 V
Min.
2.0
2.0
1
—
64.0
1.18
2
2
—
—
20.0
40.0
20.0
40.0
—
—
—
—
Values
Typ.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Max.
20.0
10.0
64
12.8
850.0
15.6
8
—
10.0
5.0
—
—
—
—
10.0
15.0
10.0
15.0
a
= –40 to +85°C
Unit
MHz *
t
µs
kHz
µs
t
t
ms
ms
ns
ns
ns
ns
OSC
cyc
subcyc
w
Reference
Figure
*
Figure 22.1
1
2
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