HD6413003TF16 Renesas Electronics America, HD6413003TF16 Datasheet - Page 530
HD6413003TF16
Manufacturer Part Number
HD6413003TF16
Description
IC H8 MCU ROMLESS QFP112
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet
1.D13003TF16V.pdf
(717 pages)
Specifications of HD6413003TF16
Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD6413003TF16
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
HD6413003TF16V
Manufacturer:
ITT
Quantity:
12 000
Company:
Part Number:
HD6413003TF16V
Manufacturer:
RENESAS
Quantity:
36
Part Number:
HD6413003TF16V
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
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16.3 System Clock Divider (Clock-Halving Version)
The system clock divider divides the oscillator output by 2 to generate the system clock (ø).
16.4 Duty Adjustment Circuit (1:1 Version)
When the oscillator frequency is 5 MHz or higher, the duty adjustment circuit adjusts the duty
cycle of the clock signal from the oscillator to generate a system clock (ø).
16.5 Prescalers
The prescalers divide the system clock (ø) to generate internal clocks (ø/2 to ø/4096).
510
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