DF2367VTE33 Renesas Electronics America, DF2367VTE33 Datasheet - Page 778

• Manufacturer Part Number: DF2367VTE33
• Description: IC H8S MCU FLASH 384K 120TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2367VTE33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 120-TQFP, 120-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2367VTE33; HD64F2367VTE33

Section 20 Flash Memory (0.18-μm F-ZTAT Version)
• Three on-board programming modes and one off-board programming mode
⎯ Boot mode
• One off-board programming mode
• Protection modes
Rev.6.00 Mar. 18, 2009 Page 718 of 980
REJ09B0050-0600
⎯ User program mode
⎯ User boot mode
⎯ PROM mode
There are two protection modes: software protection by the register setting and hardware
protection by the FWE pin. The protection state for flash memory programming/erasing can be
set.
This mode is a program mode that uses an on-chip SCI interface. The user MAT and user
boot MAT can be programmed. This mode can automatically adjust the bit rate between
host and this LSI.
The user MAT can be programmed by using the optional interface.
The user boot program of the optional interface can be made and the user MAT can be
programmed.
This mode uses the PROM programmer. The user MAT and user boot MAT can be
programmed.