PIC16C54B-04I/SO Microchip Technology, PIC16C54B-04I/SO Datasheet - Page 106

• Manufacturer Part Number: PIC16C54B-04I/SO
• Description: MICRO CTRL 512 4MHZ OTP 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C54B-04I/SO

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 12
• Program Memory Size: 768B (512 x 12)
• Program Memory Type: OTP
• Ram Size: 25 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 18-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Request inventory verification / Request inventory verification
• Eeprom Size: -
• Data Converters: -
• Connectivity: -

PIC16C5X
14.2
DS30453B-page 106
Supply Voltage
XT and RC options
HS option
RAM Data Retention Voltage
V
Power-On Reset
V
Power-On Reset
Supply Current
XT and RC
HS option
Power Down Current
XT and RC options
HS option
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25 C. This data is for design guidance
DD
DD
start voltage to ensure
rise rate to ensure
2: This is the limit to which V
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
4: Does not include current through Rext. The current through the resistor can be estimated by the
5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is
DC Characteristics: PIC16C54A-04E, 10E, 20E (Extended)
only and is not tested.
loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on
the current consumption.
formula: I
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
Characteristic
DC Characteristics
Power Supply Pins
(4)
a) The test conditions for all I
b) For standby current measurements, the conditions are the same, except that
OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to
V
the device is in SLEEP mode.
options
ss
(3)
, T0CKI = V
R
= V
(5)
DD
/2Rext (mA) with Rext in k .
DD
(2)
, MCLR = V
DD
V
V
V
S
I
I
DD
PD
Sym
DD
DR
POR
VDD
can be lowered in SLEEP mode without losing RAM data.
DD
DD
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
measurements in active operation mode are:
0.05*
Min
3.5
4.5
—
—
—
—
—
—
—
—
—
; WDT enabled/disabled as specified.
Preliminary
Typ
0.25
1.5*
V
1.8
4.8
9.0
5.0
0.8
4.0
—
—
—
SS
(1)
Max Units
5.5
5.5
3.3
10
20
22
18
22
18
—
—
—
V/ms See Section 7.4 for details on
mA
mA
mA
V
V
V
V
A
A
A
A
–40 C
Device in SLEEP mode
F
F
F
V
V
V
V
See Section 7.4 for details on
Power-on Reset
Power-on Reset
OSC
OSC
OSC
DD
DD
DD
DD
= 3.5V, WDT enabled
= 3.5V, WDT disabled
= 3.5V, WDT enabled
= 3.5V, WDT disabled
= 4.0 MHz, V
= 10 MHz, V
= 20 MHz, V
T
A
+125 C (extended)
Conditions
1998 Microchip Technology Inc.
DD
DD
DD
= 5.5V
= 5.5V
= 5.5V
PIC16C54A
DD
and V
SS
.