AT91M43300-25CI Atmel, AT91M43300-25CI Datasheet - Page 13
AT91M43300-25CI
Manufacturer Part Number
AT91M43300-25CI
Description
IC ARM7 MCU 144 BGA
Manufacturer
Atmel
Series
AT91SAMr
Datasheets
1.AT91M43300-25CC.pdf
(20 pages)
2.AT91M43300-25CI.pdf
(21 pages)
3.AT91M43300-25CI.pdf
(5 pages)
Specifications of AT91M43300-25CI
Core Processor
ARM7
Core Size
16/32-Bit
Speed
25MHz
Connectivity
EBI/EMI, SPI, UART/USART
Peripherals
WDT
Number Of I /o
58
Program Memory Type
ROMless
Ram Size
3K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LFBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
16.2
1322B–ATARM–12-Dec-05
RoHS Soldering Profile
Table 16-3
Table 16-3.
Note:
A maximum of three reflow passes is allowed per component.
Profile Feature
Average Ramp-up Rate (183 C to Peak)
Preheat Temperature 125 C ±25 C
Temperature Maintained Above 183 C
Time within 5 C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25 C to Peak Temperature
It is recomended to apply a soldering temperature higher than 250°C.
gives the recommended soldering profile from J-STD-20C.
Soldering Profile RoHS Compliant Package
3 C/sec. max.
180 sec. max
60 sec. to 150 sec.
20 sec. to 40 sec.
260 C
6 C/sec.
8 min. max
Convection or IR/Convection
AT91M43300
13