PIC16C66-04E/SP Microchip Technology, PIC16C66-04E/SP Datasheet - Page 299
PIC16C66-04E/SP
Manufacturer Part Number
PIC16C66-04E/SP
Description
IC MCU OTP 8KX14 PWM 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F818-ISO.pdf
(6 pages)
3.PIC16LC62A-04SP.pdf
(337 pages)
4.PIC16C66-04SO.pdf
(6 pages)
Specifications of PIC16C66-04E/SP
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
14KB (8K x 14)
Program Memory Type
OTP
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
- PIC16F616T-ISL PDF datasheet
- PIC16F818-ISO PDF datasheet #2
- PIC16LC62A-04SP PDF datasheet #3
- PIC16C66-04SO PDF datasheet #4
- Current page: 299 of 337
- Download datasheet (3Mb)
25.9
Base
Plane
Seating
Plane
1997 Microchip Technology Inc.
Symbol
A1
A2
A3
B1
D1
E1
eA
eB
S1
Pin #1
Indicator Area
e1
B1
C
D
E
N
S
A
B
L
28-Lead Ceramic Side Brazed Dual In-Line with Window (300 mil)
N
S
B
35.204
32.893
3.937
1.016
2.921
1.930
0.406
1.219
0.228
7.620
7.366
2.413
7.366
7.594
3.302
1.143
0.533
Min
28
0
Package Group: Ceramic Side Brazed Dual In-Line (CER)
Millimeters
35.916
33.147
5.030
1.524
3.506
2.388
0.508
1.321
0.305
8.128
7.620
2.667
7.874
8.179
4.064
1.397
0.737
Max
10
28
D
D1
Reference
Reference
Typical
Typical
Typical
Notes
0.155
0.040
0.115
0.076
0.016
0.048
0.009
1.386
1.295
0.300
0.290
0.095
0.290
0.299
0.130
0.045
0.021
Min
28
0
S1
e1
L
E1 E
A1
(JW)
A3
Inches
0.198
0.060
0.138
0.094
0.020
0.052
0.012
1.305
0.320
0.300
0.105
0.310
0.322
0.160
0.055
0.029
1.414
Max
10
28
PIC16C6X
A
A2
DS30234D-page 299
eA
eB
Notes
C
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