PIC16LC554-04E/SS Microchip Technology, PIC16LC554-04E/SS Datasheet - Page 92
![IC MCU OTP 512X14 20SSOP](/photos/6/58/65895/150-20-ssop_sml.jpg)
PIC16LC554-04E/SS
Manufacturer Part Number
PIC16LC554-04E/SS
Description
IC MCU OTP 512X14 20SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet
1.PIC16C554-04P.pdf
(108 pages)
Specifications of PIC16LC554-04E/SS
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
13
Program Memory Size
896B (512 x 14)
Program Memory Type
OTP
Ram Size
80 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
20-SSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
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PIC16C55X
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)
DS40143D-page 90
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
n
β
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
E1
B1
eB
A1
A
E
D
B
α
n
p
L
c
β
MIN
1.345
Preliminary
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
28
10
10
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.430
.022
15
15
MIN
34.16
3.56
3.18
0.38
7.62
6.99
3.18
0.20
1.02
8.13
0.41
5
5
2002 Microchip Technology Inc.
MILLIMETERS
p
α
NOM
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
28
10
10
A2
L
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15
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