PIC16F74T-I/ML Microchip Technology, PIC16F74T-I/ML Datasheet - Page 158
![IC MCU FLASH 4KX14 A/D 44QFN](/photos/6/81/68122/150-44-qfn_sml.jpg)
PIC16F74T-I/ML
Manufacturer Part Number
PIC16F74T-I/ML
Description
IC MCU FLASH 4KX14 A/D 44QFN
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F73-ISP.pdf
(174 pages)
5.PIC16F73-ISP.pdf
(14 pages)
6.PIC16F73-ISP.pdf
(12 pages)
Specifications of PIC16F74T-I/ML
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Program Memory Size
7KB (4K x 14)
Program Memory Type
FLASH
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFN
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
192 B
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
33
Number Of Timers
3 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F818-ISO PDF datasheet #3
- PIC16F73-ISP PDF datasheet #4
- PIC16F73-ISP PDF datasheet #5
- PIC16F73-ISP PDF datasheet #6
- Current page: 158 of 174
- Download datasheet (5Mb)
PIC16F7X
28-Lead Plastic Micro Leadframe Package (MF) 6x6 mm Body (MLF)
DS30325B-page 156
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-114
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Width
Molded Package Width
Exposed Pad Width
Overall Length
Molded Package Length
Exposed Pad Length
Lead Width
Lead Length
Tie Bar Width
Tie Bar Length
Chamfer
Mold Draft Angle Top
A1
CH x 45
TOP VIEW
E1
E
Dimension Limits
n
Units
CH
A2
A1
A3
E1
E2
D1
D2
A
E
D
B
R
Q
n
p
L
2
1
MIN
D1
A2
.000
.140
.140
.009
.020
.005
.012
.009
D
A3
.008 REF.
INCHES
.026 BSC
.236 BSC
.226 BSC
.236 BSC
.226 BSC
A
NOM
D2
.0004
.033
.026
.146
.146
.011
.024
.007
.016
.017
28
R
EXPOSED
MAX
METAL
.039
.031
.002
.152
.152
.014
.030
.010
.026
.024
PADS
12
BOTTOM VIEW
MIN
E2
0.00
3.55
3.55
0.23
0.50
0.13
0.30
0.24
MILLIMETERS*
2002 Microchip Technology Inc.
0.20 REF.
0.65 BSC
6.00 BSC
5.75 BSC
6.00 BSC
5.75 BSC
NOM
0.85
0.65
0.01
3.70
3.70
0.28
0.60
0.17
0.40
0.42
L
28
MAX
Q
B
p
1.00
0.80
0.05
3.85
3.85
0.35
0.75
0.23
0.65
0.60
12
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