PIC16F74T-I/ML Microchip Technology, PIC16F74T-I/ML Datasheet - Page 159

• Manufacturer Part Number: PIC16F74T-I/ML
• Description: IC MCU FLASH 4KX14 A/D 44QFN
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F74T-I/ML

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 33
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• Ram Size: 192 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFN
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 192 B
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 33
• Number Of Timers: 3 bit
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

28-Lead Plastic Micro Leadframe Package (MF) 6x6 mm Body (MLF) (Continued)
2002 Microchip Technology Inc.
Pitch
Pad Width
Pad Length
Pad to Solder Mask
*Controlling Parameter
Drawing No. C04-2114
SOLDER
MASK
M
Dimension Limits
M
Units
M
B
p
L
MIN
.009
.020
.005
INCHES
.026 BSC
NOM
B
.011
.024
MAX
.014
.030
.006
MIN
0.23
0.50
0.13
MILLIMETERS*
0.65 BSC
NOM
PIC16F7X
0.28
0.60
PACKAGE
EDGE
L
p
DS30325B-page 157
MAX
0.35
0.75
0.15