EP7312-IV Cirrus Logic Inc, EP7312-IV Datasheet - Page 38
![IC ARM720T MCU 74MHZ 208-LQFP](/photos/12/44/124402/ep7312-iv_sml.jpg)
EP7312-IV
Manufacturer Part Number
EP7312-IV
Description
IC ARM720T MCU 74MHZ 208-LQFP
Manufacturer
Cirrus Logic Inc
Series
EP7r
Datasheet
1.EP7312-CVZ.pdf
(64 pages)
Specifications of EP7312-IV
Core Processor
ARM7
Core Size
32-Bit
Speed
74MHz
Connectivity
Codec, DAI, EBI/EMI, IrDA, Keypad, SPI/Microwire1, UART/USART
Peripherals
LCD, LED, MaverickKey, PWM
Number Of I /o
27
Program Memory Type
ROMless
Ram Size
56K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 2.7 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
208-LQFP
For Use With
598-1209 - KIT DEVELOPMENT EP73XX ARM7
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Other names
598-1245
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EP7312-IV-90
Manufacturer:
Cirrus Logic Inc
Quantity:
10 000
EP7312
High-Performance, Low-Power System on Chip
204-Ball TFBGA Package Characteristics
38
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
C
1
A1 CORNER
2 3
4 5 6
TOP VIEW
SEATING PLANE
7 8
9 10 11
12 13
14 15
16
17
©
Figure 17. 204-Ball TFBGA Package
18
Copyright Cirrus Logic, Inc. 2005
19 20
(All Rights Reserved)
A
B
Ø0.25~0.35(204X)
Ø0.15 M C A B
20
19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
Ball Diameter :
Ball Pitch :
BOTTOM VIEW
13±0.05
12.35
0.65
0.3
Substrate Thickness :
Mold Thickness :
A1 CORNER
0.65
DS508F1
0.36
0.53
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y