MC68HC705C9ACP Freescale Semiconductor, MC68HC705C9ACP Datasheet - Page 107

• Manufacturer Part Number: MC68HC705C9ACP
• Description: IC MCU 2.1MHZ 16K OTP 40-DIP
• Manufacturer: Freescale Semiconductor
• Series: HC05r

Specifications of MC68HC705C9ACP

• Core Processor: HC05
• Core Size: 8-Bit
• Speed: 2.1MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number Of I /o: 24
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: OTP
• Ram Size: 352 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 40-DIP (0.600", 15.24mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -

Chapter 13
Mechanical Specifications
13.1 Introduction
This section describes the dimensions of the plastic dual in-line package (DIP), plastic shrink dual in-line
package (SDIP), plastic leaded chip carrier (PLCC), and quad flat pack (QFP) MCU packages.
The following figures show the latest package drawings at the time of this publication. To make sure that
you have the latest package specifications, contact your local Freescale Sales Office.
13.2 40-Pin Plastic Dual In-Line (DIP) Package (Case 711-03)
Freescale Semiconductor
1
40
H
G
Figure 13-1. 40-Pin Plastic DIP Package (Case 711-03)
A
MC68HC05C9A Advance Information Data Sheet, Rev. 4.1
F
D
21
20
SEATING
PLANE
N
K
B
C
M
L
J
NOTES:
1. POSITION TOLERANCE OF LEADS (D), SHALL
2. DIMENSION L TO CENTER OF LEADS WHEN
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
BEWITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITIONS, IN RELATION TO SEATING PLANE
AND EACH OTHER.
FORMED PARALLEL.
DIM
A
B
C
D
G
H
K
M
N
F
J
L
51.69
13.72
MIN
3.94
0.36
1.02
1.65
0.20
2.92
0.51
MILLIMETERS
0°
15.24 BSC
2.54 BSC
52.45
14.22
MAX
5.08
0.56
1.52
2.16
0.38
3.43
1.02
1°
2.035
0.540
0.155
0.014
0.040
0.065
0.008
0.115
0.020
MIN
0°
0.100 BSC
0.600 BSC
INCHES
2.065
0.560
0.200
0.022
0.060
0.085
0.015
0.135
0.040
MAX
1°
107