MC68HC705C9ACP Freescale Semiconductor, MC68HC705C9ACP Datasheet - Page 109

IC MCU 2.1MHZ 16K OTP 40-DIP

MC68HC705C9ACP

Manufacturer Part Number
MC68HC705C9ACP
Description
IC MCU 2.1MHZ 16K OTP 40-DIP
Manufacturer
Freescale Semiconductor
Series
HC05r
Datasheet

Specifications of MC68HC705C9ACP

Core Processor
HC05
Core Size
8-Bit
Speed
2.1MHz
Connectivity
SCI, SPI
Peripherals
POR, WDT
Number Of I /o
24
Program Memory Size
16KB (16K x 8)
Program Memory Type
OTP
Ram Size
352 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68HC705C9ACP
Manufacturer:
AD
Quantity:
1 200
13.4 44-Lead Plastic Leaded Chip Carrier (PLCC) (Case 777-02)
Freescale Semiconductor
-L-
C
0.010 (0.25)
Z
44
G
G1
S
A
R
T
1
L-M
-N-
MC68HC05C9A Advance Information Data Sheet, Rev. 4.1
NOTES:
MINED
V
1. DATUMS -L-, -M-, AND -N- ARE DETERMINED
2. DIMENSION G1, TRUE POSITION TO BE
3. DIMENSION R AND U DO NOT INCLUDE MOLD
4. DIMENSIONING AND TOLERANCING PER ANSI
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
7. DIMINSION H DOES NOT INCLUDE DAMBAR
WHERE TOP OF LEAD SHOLDERS EXITS
PLASTIC BODY AT MOLD PARTING LINE.
MEASURED AT DATUM -T-, SEATING PLANE.
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
Y14.5M, 1982.
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE DETER-
AT THE OUTERMOST EXTREMES OF THE
PLASTIC BODY EXCLUSIVE OF THE MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND
INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM
OF THE PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTUSION(S) SHALL NOT CAUSE THE H
DIMINSION TO BE GREATER THAN 0.037
(0.940110). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMINISION TO SMALLER
THAN 0.025 (0.635).
S
Figure 13-3. 44-Lead PLCC (Case 777-02)
N S
E
Y
BRK
0.007(0.180)
0.007(0.180)
-M-
W
J
VIEW S
D
D
-T-
M
M
T
T
0.004 (0.10)
SEATING
PLANE
L-M
L-M
44-Lead Plastic Leaded Chip Carrier (PLCC) (Case 777-02)
S
S
DIM
G1
K1
W
N S
N S
G
A
B
C
E
F
H
K
R
U
V
X
Y
Z
J
0.042
MIN
0.685
0.685
0.165
0.090
0.013
0.026
0.020
0.025
0.650
0.650
0.042
0.042
0.610
0.040
0.050 BSC
B
INCHES
X
Z
K
VIEW D-D
MAX
0.695
0.695
0.180
0.110
0.019
0.032
0.656
0.656
0.048
0.048
0.056
0.020
0.630
10°
U
VIEW S
0.007(0.180)
H
17.40
17.40
16.51
16.51
15.50
MIN
4.20
2.29
0.33
0.66
0.51
0.64
1.07
1.07
1.07
1.02
MILLIMETERS
0.007(0.180)
1.27 BSC
0.007(0.180)
F
MAX
K1
17.65
17.65
16.66
16.66
16.00
4.57
2.79
0.48
0.81
1.21
1.21
1.42
0.50
10°
M
0.007(0.180)
G1
0.010 (0.25)
T
M
M
L-M
T
T
S
M
L-M
L-M
S
N S
T
T
S
S
L-M
L-M
N S
N S
S
S
N S
N S
109

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