DSP56F801FA80 Freescale Semiconductor, DSP56F801FA80 Datasheet - Page 16

• Manufacturer Part Number: DSP56F801FA80
• Description: IC DSP 80MHZ 8K FLASH 48-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxr

Specifications of DSP56F801FA80

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 11
• Program Memory Size: 20KB (10K x 16)
• Program Memory Type: FLASH
• Ram Size: 2K x 16
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: DSP56F801BU80; DSP56F801BU80

Notes:
16
Junction to ambient
Natural convection
Junction to ambient (@1m/sec)
Junction to ambient
Natural convection
Junction to ambient (@1m/sec)
Junction to case
Junction to center of case
I/O pin power dissipation
Power dissipation
Junction to center of case
1.
2.
3.
4.
5.
6.
7.
Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.
Determined on 2s2p thermal test board.
Junction to ambient thermal resistance, Theta-JA (
specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was also simulated on
a thermal test board with two internal planes (2s2p where s is the number of signal layers and p is the number
of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA for forced convection or with the
non-single layer boards is Theta-JMA.
Junction to case thermal resistance, Theta-JC (R
using the cold plate technique with the cold plate temperature used as the "case" temperature. The basic cold
plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal
metric to use to calculate thermal performance when the package is being used with a heat sink.
Thermal Characterization Parameter, Psi-JT (Ψ
thermocouple on top center of case as defined in JESD51-2. Ψ
temperature in steady state customer environments.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
board thermal resistance.
See Section 5.1 from more details on thermal design considerations.
TJ = Junction Temperature
TA = Ambient Temperature
Characteristic
Table 3-3 Thermal Characteristics
Four layer board (2s2p)
Four layer board (2s2p)
Comments
56F801 Technical Data, Rev. 17
JT
θJC
), is the "resistance" from junction to reference point
R
), was simulated to be equivalent to the measured values
θJA
) was simulated to be equivalent to the JEDEC
Symbol
P
(2s2p)
R
R
R
R
R
P
Ψ
DMAX
P
θJMA
θJMA
θJMA
θJC
θJA
JT
I/O
JT
D
is a useful value to use to estimate junction
P
D
User Determined
= (I
(TJ - TA) /R
48-pin LQFP
6
DD
Value
50.6
47.4
39.1
37.9
17.3
1.2
x V
DD
θ
+ P
JA
Freescale Semiconductor
I/O
)
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
W
W
W
Notes
4, 5
1,2
1,2
2
2
3
7