C8051F300 Silicon Laboratories Inc, C8051F300 Datasheet - Page 84

• Manufacturer Part Number: C8051F300
• Description: IC 8051 MCU 8K FLASH 11MLP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F30xr

Specifications of C8051F300

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), UART/USART
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number Of I /o: 8
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 11-VQFN
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

C8051F300/1/2/3/4/5
10.1.3. FLASH Write Procedure
FLASH bytes are programmed by software with the following sequence:
Steps 5-7 must be repeated for each byte to be written. After FLASH writes are complete, PSWE should be cleared so
that MOVX instructions do not target program memory.
84
†
Note: 512 bytes at location 0x1E00 to 0x1FFF are reserved for factory use
(FLASH writes from
SYSCLK Frequency
Erase Cycle Time
Write Cycle Time
application code)
PARAMETER
FLASH Size
FLASH Size
FLASH Size
Endurance
Step 1. Disable interrupts (recommended).
Step 2. Erase the 512-byte FLASH page containing the target location, as described in
Step 3. Set the PSWE bit in PSCTL.
Step 4. Clear the PSEE bit in PSCTL.
Step 5. Write the first key code to FLKEY: 0xA5.
Step 6. Write the second key code to FLKEY: 0xF1.
Step 7. Using the MOVX instruction, write a single data byte to the desired location within the 512-byte
sector.
Table 10.1. FLASH Electrical Characteristics
25 MHz System Clock
25 MHz System Clock
C8051F300/1/2/3
CONDITIONS
C8051F304
C8051F305
Rev. 2.3
8192
MIN
4096
2048
20k
100
10
40
†
TYP
100k
15
55
MAX
20
70
Section
Erase/Write
UNITS
10.1.2.
bytes
bytes
bytes
kHz
ms
µs