PA241DF Cirrus Logic Inc, PA241DF Datasheet

PA241DF

Manufacturer Part Number

PA241DF

Description

OP AMP HV 350V .06A 24-PSOP DF

Manufacturer

Cirrus Logic Inc

Series

Apex Precision Power™r

Datasheets

1.PA241DF.pdf (7 pages)

2.PA241DF.pdf (3 pages)

Specifications of PA241DF

Amplifier Type

Power

Number Of Circuits

Slew Rate

30 V/µs

Gain Bandwidth Product

3MHz

Current - Input Bias

50pA

Voltage - Input Offset

25000µV

Current - Supply

2.2mA

Current - Output / Channel

120mA

Voltage - Supply, Single/dual (±)

100 V ~ 350 V, ±50 V ~ 175 V

Operating Temperature

-25°C ~ 85°C

Mounting Type

Surface Mount

Package / Case

24-PSOP

Number Of Channels

Voltage Gain Db

96 dB

Common Mode Rejection Ratio (min)

84 dB

Input Offset Voltage

40 mV

Maximum Operating Temperature

+ 85 C

Mounting Style

SMD/SMT

Maximum Dual Supply Voltage

+/- 175 V

Minimum Operating Temperature

- 25 C

For Use With

598-1459 - EVALUATION KIT FRO PA241DF

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Output Type

-3db Bandwidth

Lead Free Status / Rohs Status

Details

Other names

598-1357

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Meier Automation Equipment Co., Limited

Part Number:

PA241DF

Manufacturer:

APEX

Quantity:

20 000

Current page: 1 of 3
Download datasheet (463Kb)

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EVALUATION KIT

evaluation of the PA241CE. Provided items include: PC boards

to make a ﬁve sided box, cage jacks and 200V ceramic bypass

capacitors. The top board has pads for two TO-3 packages

and one MO127 package. Two ends of the box are predrilled

for banana jacks and BNC connectors (not supplied). Ampli-

ﬁers and heatsinks are sold separately.

evaluation of the PA241DW. Ampliﬁers are sold separately.

evaluation of the PA241DF surface mount package. Pro-

vided items include: PC board, ceramic bypass capacitor,

surface mount heatsink rated at 20°C/W. Ampliﬁers are sold

separately.

the PA241CE in the TO-3 package. Thermal ratings are for

optimum mounting in free air.

HS01 11.6°C/W

HS02 4.5°C/W

APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com

HEATSINKS FOR THE CE (TO-3) PACKAGE

EK09 is an easy to use engineering platform for prototype

EK42 is an easy to use PC board platform for prototype

EK13 is an easy to use engineering platform for prototype

The following heatsinks are mechanically compatible with

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HS03 1.7°C/W

HS04 0.95°C/W

HS05 0.85°C/W

Related parts for PA241DF

PA241DF Summary of contents

Page 1

... EK42 is an easy to use PC board platform for prototype evaluation of the PA241DW. Ampliﬁers are sold separately. EK13 is an easy to use engineering platform for prototype evaluation of the PA241DF surface mount package. Pro- vided items include: PC board, ceramic bypass capacitor, surface mount heatsink rated at 20°C/W. Ampliﬁers are sold separately ...

Page 2

... APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739 2 HS14 2°C/W HEATSINK FOR THE DF (24 PIN PSOP) PACKAGE HS24 The HS24 is mechanically compatible with the PA241DF in the PSOP surface mount package. The free-air thermal rating is 20°C/W CAGE JACKS FOR THE CE (TO-3) PACKAGE MS02 ...

Page 3

Part number MS02 consists of a package of 8 cage jacks. These are mounted directly in a print circuit board. Use a spacer between the PCB and the heatsink to avoid short circuits. SOCKET FOR THE CE (TO-3) PACKAGE MS03 ...

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