AD8052ARZ Analog Devices Inc, AD8052ARZ Datasheet - Page 9

• Manufacturer Part Number: AD8052ARZ
• Description: IC OPAMP VF R-R DUAL LDIST 8SOIC
• Manufacturer: Analog Devices Inc

Specifications of AD8052ARZ

• Slew Rate: 170 V/µs
• Amplifier Type: Voltage Feedback
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• -3db Bandwidth: 110MHz
• Current - Input Bias: 1.4µA
• Voltage - Input Offset: 1800µV
• Current - Supply: 4.8mA
• Current - Output / Channel: 45mA
• Voltage - Supply, Single/dual (±): 3 V ~ 12 V, ±1.5 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Op Amp Type: High Speed
• No. Of Amplifiers: 2
• Bandwidth: 110MHz
• Supply Voltage Range: 3V To 12V
• Amplifier Case Style: SOIC
• No. Of Pins: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Gain Bandwidth Product: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Internal Power Dissipation
Input Voltage (Common Mode)
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range (R)
Operating Temperature Range (A Grade)
Lead Temperature (Soldering 10 sec)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Specification is for device in free air.
Table 5. Thermal Resistance
Package Type
8-Lead SOIC
5-Lead SOT-23
8-Lead MSOP
14-Lead SOIC
14-Lead TSSOP
See Table 5.
SOIC Packages
SOT-23 Package
MSOP Package
TSSOP Package
1
θ
125
180
150
90
120
JA
12.6 V
Observe power
derating curves
Observe power
derating curves
Observe power
derating curves
Observe power
derating curves
±2.5 V
Observe power
derating curves
−65°C to +150°C
−40°C to +125°C
Ratings
±V
300°C
S
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
Rev. J | Page 9 of 24
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8051/AD8052/AD8054 is limited by the associated rise in
junction temperature. The maximum safe junction temperature
for plastic encapsulated devices is determined by the glass
transition temperature of the plastic, approximately 150°C.
Temporarily exceeding this limit can cause a shift in parametric
performance due to a change in the stresses exerted on the die
by the package. Exceeding a junction temperature of 175°C for
an extended period can result in device failure.
While the AD8051/AD8052/AD8054 are internally short-
circuit protected, this cannot be sufficient to guarantee that the
maximum junction temperature (150°C) is not exceeded under
all conditions. To ensure proper operation, it is necessary to
observe the maximum power derating curves.
ESD CAUTION
2.5
2.0
1.5
1.0
0.5
0
–55
TSSOP-14
MSOP-8
–35
Temperature for AD8051/AD8052/AD8054
Figure 6. Maximum Power Dissipation vs.
–15
SOIC-8
SOIC-14
AMBIENT TEMPERATURE (°C)
5
AD8051/AD8052/AD8054
SOT-23-5
15
35
55
75
95
115