AD627ARZ Analog Devices Inc, AD627ARZ Datasheet - Page 20

IC AMP INST R-R 25MA 8SOIC

AD627ARZ

Manufacturer Part Number
AD627ARZ
Description
IC AMP INST R-R 25MA 8SOIC
Manufacturer
Analog Devices Inc
Type
Rail-to-Railr
Datasheets

Specifications of AD627ARZ

Slew Rate
0.06 V/µs
Amplifier Type
Instrumentation
Number Of Circuits
1
Output Type
Rail-to-Rail
-3db Bandwidth
80kHz
Current - Input Bias
2nA
Voltage - Input Offset
25µV
Current - Supply
60µA
Current - Output / Channel
25mA
Voltage - Supply, Single/dual (±)
2.2 V ~ 36 V, ±1.1 V ~ 18 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
No. Of Amplifiers
1
Input Offset Voltage
200µV
Gain Db Min
5dB
Gain Db Max
1000dB
Bandwidth
40MHz
Amplifier Output
Rail To Rail
Cmrr
77dB
Supply Voltage Range
± 1.1V To ±
Common Mode Rejection Ratio
90
Current, Input Bias
3 nA (Single), 2 nA (Dual)
Current, Input Offset
0.3 nA
Current, Supply
60 μA
Impedance, Thermal
155 °C/W
Package Type
SOIC-8
Power Dissipation
0.8 W
Resistance, Input
20 Gigaohms (Differential), 20 Gigaohms (Common-Mode)
Temperature, Operating, Range
-40 to +85 °C
Voltage, Gain
1000 V/V
Voltage, Input
-35.9 to +35 V (Single), -17.9 to +17 V (Dual)
Voltage, Input Offset
50 μV (Single), 25 μV (Dual)
Voltage, Noise
38 nV/sqrt Hz
Voltage, Supply
2.2 to ±18 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Gain Bandwidth Product
-
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

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AD627
LAYOUT AND GROUNDING
The use of ground planes is recommended to minimize the
impedance of ground returns (and hence, the size of dc errors).
To isolate low level analog signals from a noisy digital environment,
many data acquisition components have separate analog and
digital ground returns (see Figure 47). Return all ground pins
from mixed-signal components, such as analog-to-digital
converters, through the high quality analog ground plane.
Digital ground lines of mixed-signal components should also
be returned through the analog ground plane. This may seem
to break the rule of separating analog and digital grounds;
however, in general, there is also a requirement to keep the
voltage difference between digital and analog grounds on a
converter as small as possible (typically, <0.3 V). The increased
noise, caused by the digital return currents of the converter
flowing through the analog ground plane, is generally negligible.
To maximize isolation between analog and digital, connect the
ground planes back at the supplies.
Figure 47. Optimal Grounding Practice for a Bipolar Supply Environment with Separate Analog and Digital Supplies
2
3
AD627
AD627
2
3
7
Figure 48. Optimal Ground Practice in a Single-Supply Environment
0.1µF
AD627
7
0.1µF
4
5
ANALOG POWER SUPPLY
+5V
4
5
6
6
–5V
4
3
Rev. D | Page 20 of 24
GND
V
V
4
IN1
IN2
V
IN
1
POWER SUPPLY
V
ADC
5V
V
DD
1
DD
ADC
6
If there is only one power supply available, it must be shared by
both digital and analog circuitry. Figure 48 shows how to minimize
interference between the digital and analog circuitry. As in the
previous case, use separate analog and digital ground planes or
use reasonably thick traces as an alternative to a digital ground
plane. Connect the ground planes at the ground pin of the power
supply. Run separate traces (or power planes) from the power
supply to the supply pins of the digital and analog circuits. Ideally,
each device should have its own power supply trace, but they
can be shared by multiple devices if a single trace is not used to
route current to both digital and analog circuitry.
AGND
AD7892-2
GND
AGND
AD7892-2
14
DGND
DGND
DIGITAL POWER SUPPLY
12
12
GND
AGND
PROCESSOR
MICRO-
PROCESSOR
V
DD
MICRO-
+5V
V
DD
DGND

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