PA95 Cirrus Logic Inc, PA95 Datasheet

PA95

Manufacturer Part Number

PA95

Description

OP AMP HV 900V .100A 8-SIP DQ

Manufacturer

Cirrus Logic Inc

Series

Apex Precision Power™r

Datasheets

1.EK19.pdf (1 pages)

2.PA95.pdf (6 pages)

Specifications of PA95

Amplifier Type

Power

Number Of Circuits

Slew Rate

30 V/µs

Gain Bandwidth Product

10MHz

Current - Input Bias

200pA

Voltage - Input Offset

500µV

Current - Supply

1.6mA

Current - Output / Channel

100mA

Voltage - Supply, Single/dual (±)

100 V ~ 900 V, ±50 V ~ 450 V

Operating Temperature

-25°C ~ 85°C

Mounting Type

Through Hole

Package / Case

12-SIP (8 leads)

Number Of Channels

Voltage Gain Db

118 dB

Common Mode Rejection Ratio (min)

80 dB

Input Offset Voltage

5 mV

Maximum Operating Temperature

+ 85 C

Mounting Style

Through Hole

Maximum Dual Supply Voltage

+/- 450 V

Minimum Operating Temperature

- 25 C

For Use With

598-1462 - EVALUATION KIT FOR PA94/PA95

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant

Output Type

-3db Bandwidth

Lead Free Status / Rohs Status

In Transition

Other names

598-1335

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� � � � � � � � � � � � � � �

EVALUATION KIT

evaluation. It accommodates only the straight pin version of

the ampliﬁer. The PC board is also a good starting point for

an application speciﬁc layout. Provided items include: PC

board, heatsink rated at 5.3°C/W, socket, thermal washers,

ceramic bypass capacitors and transient voltage suppressors.

The ampliﬁer is sold separately. Common hardware such as

screws, nuts and user’s preference for I/O connectors are

not provided.

HEATSINKS

this ampliﬁer. Thermal ratings are for optimum mounting in

free air.

HS20

board with screws.

HS27 5.3°C/W

board by soldering.

APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com

This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All speciﬁcations are subject to change without notice.

EK19 is an easy to use engineering platform for prototype

The following heatsinks are mechanically compatible with

The HS20 is designed to be fastened vertically to a PC

The HS27 is designed to be fastened vertically to a PC

1.3°C/W

� � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � � �

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hole is drilled and deburred. Requirements for the potential

heatsink or chassis member are ﬂatness of 2 mils per inch in

an area large enough to ﬁt the package.

SOCKET

MS06

mounted directly in a print circuit board. Use a spacer between

the PCB and the heatsink to avoid short circuits.

THERMAL WASHER

TW13

NOTES:

1. Base material is Kapton MT, 0.002” thick. Do not allow the

2. For optimum thermal transfer, avoid abrasive handling

3. The dry thermal compound will ﬂow ﬁlling header to heatsink

4. Do not store unused thermal washers above 40°C.

5. A new washer must be used for each mounting.

6. Part number TW13 consists of a package of 10 washers.

7. Thermal resistance is 0.2°C/W.

Many other heatsinks can be used with this ampliﬁer if a

Part number MS06 consists of 2 socket strips. These are

washer to touch pins of the ampliﬁer.

of washers which can damage their 0.5mil thick layer of

thermal compound with which each side is coated.

voids as soon as the material reached 60°C.

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