LMC662AIM/NOPB National Semiconductor, LMC662AIM/NOPB Datasheet - Page 9

IC OP AMP DUAL CMOS 8-SOIC

LMC662AIM/NOPB

Manufacturer Part Number
LMC662AIM/NOPB
Description
IC OP AMP DUAL CMOS 8-SOIC
Manufacturer
National Semiconductor
Datasheets

Specifications of LMC662AIM/NOPB

Amplifier Type
General Purpose
Number Of Circuits
2
Output Type
Rail-to-Rail
Slew Rate
1.1 V/µs
Gain Bandwidth Product
1.4MHz
Current - Input Bias
0.002pA
Voltage - Input Offset
1000µV
Current - Supply
750µA
Current - Output / Channel
40mA
Voltage - Supply, Single/dual (±)
4.75 V ~ 15.5 V, ±2.38 V ~ 7.75 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Bandwidth
1.4 MHz
Channel Separation
130
Common Mode Rejection Ratio
83
Current, Input Bias
0.002 pA
Current, Input Offset
0.001 pA
Current, Output
40 mA
Current, Supply
0.75 mA
Harmonic Distortion
0.01 %
Impedance, Thermal
165 °C/W
Number Of Amplifiers
Dual
Package Type
SO-8
Resistance, Input
1 Teraohms
Temperature, Operating, Range
-40 to +85 °C
Voltage, Gain
2000 V/mV
Voltage, Input
4.75 to 15.5 V
Voltage, Noise
22 nV/sqrt Hz
Voltage, Offset
1 mV
Voltage, Output, High
14.63 V
Voltage, Output, Low
0.26 V
Voltage, Supply
5 V
Number Of Channels
2
Voltage Gain Db
126.02 dB
Common Mode Rejection Ratio (min)
70 dB
Input Voltage Range (max)
15.5 V
Input Voltage Range (min)
4.75 V
Input Offset Voltage
3 mV at 5 V
Operating Supply Voltage
5 V, 9 V, 12 V, 15 V
Supply Current
1.3 mA at 5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
-3db Bandwidth
-
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device
Other names
*LMC662AIM/NOPB
Application Hints
dard op-amp configurations. If both inputs are active and at
high impedance, the guard can be tied to ground and still
provide some protection; see Figure 9.
FIGURE 7. Guard Ring Connections: Non-Inverting
FIGURE 6. Guard Ring Connections: Inverting
FIGURE 5. Example, using the LMC660,
of Guard Ring in P.C. Board Layout
Amplifier
Amplifier
(Continued)
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The designer should be aware that when it is inappropriate
to lay out a PC board for the sake of just a few circuits, there
is another technique which is even better than a guard ring
on a PC board: Don’t insert the amplifier’s input pin into the
board at all, but bend it up in the air and use only air as an
insulator. Air is an excellent insulator. In this case you may
have to forego some of the advantages of PC board con-
struction, but the advantages are sometimes well worth the
effort of using point-to-point up-in-the-air wiring. See Figure
10.
(Input pins are lifted out of PC board and soldered directly to components.
All other pins connected to PC board.)
FIGURE 9. Guard Ring Connections: Howland Current
FIGURE 8. Guard Ring Connections: Follower
FIGURE 10. Air Wiring
Pump
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