LM6181IN/NOPB National Semiconductor, LM6181IN/NOPB Datasheet - Page 6

• Manufacturer Part Number: LM6181IN/NOPB
• Description: IC AMP CUR FEEDBACK 100MHZ 8-DIP
• Manufacturer: National Semiconductor
• Series: VIP™ IIr

Specifications of LM6181IN/NOPB

• Amplifier Type: Current Feedback
• Number Of Circuits: 1
• Slew Rate: 2000 V/µs
• -3db Bandwidth: 100MHz
• Current - Input Bias: 5µA
• Voltage - Input Offset: 3500µV
• Current - Supply: 7.5mA
• Current - Output / Channel: 130mA
• Voltage - Supply, Single/dual (±): 7 V ~ 32 V, ±3.5 V ~ 16 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Number Of Channels: 1
• Common Mode Rejection Ratio (min): 50 dB
• Input Offset Voltage: 3 mV at +/- 5 V
• Operating Supply Voltage: 9 V, 12 V, 15 V, 18 V, 24 V, 28 V
• Supply Current: 8.5 mA at +/- 5 V
• Maximum Operating Temperature: + 85 C
• Maximum Dual Supply Voltage: +/- 16 V
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• Gain Bandwidth Product: -
• Lead Free Status / Rohs Status: Details
• Other names: *LM6181IN; *LM6181IN/NOPB; LM6181IN

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Symbol
BW
PBW
SR
t
t
t
i
i
e
n(+)
n(−)
s
r
p
, t
n
The following specifications apply for Supply Voltage =
its apply at the temperature extremes; all other limits T
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions the device is intended to
be functional, but device parameter specifications may not be guaranteed under these conditions. For guaranteed specifications and test conditions, see the
Electrical Characteristics.
Note 2: Human body model 100 pF and 1.5 kΩ.
Note 3: The typical junction-to-ambient thermal resistance of the molded plastic DIP(N) package soldered directly into a PC board is 102˚C/W. The junction-to-
ambient thermal resistance of the S.O. surface mount (M) package mounted flush to the PC board is 70˚C/W when pins 1, 4, 8, 9 and 16 are soldered to a total 2
in
junction-to-ambient thermal resistance of the S.O. (M-8) package soldered directly into a PC board is 153˚C/W.
Note 4: Typical values represent the most likely parametric norm.
Note 5: All limits guaranteed at room temperature (standard type face) or at operating temperature extremes (bold face type).
Note 6: Measured from +25% to +75% of output waveform.
Note 7: Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150˚C. Output
currents in excess of
Note 8: For guaranteed Military Temperature Range parameters see RETS6181X.
±
f
2
5V AC Electrical Characteristics
1 oz. copper trace. The 16-pin S.O. (M) package must have pin 4 and at least one of pins 1, 8, 9, or 16 connected to V
Closed Loop Bandwidth −3
dB
Power Bandwidth
Slew Rate
Settling Time (0.1%)
Rise and Fall Time
Propagation Delay Time
Non-Inverting Input Noise
Current Density
Inverting Input Noise
Current Density
Input Noise Voltage
Density
Second Harmonic Distortion 2 V
Third Harmonic Distortion
Differential Gain
Differential Phase
Parameter
±
130 mA over a long term basis may adversely affect reliability.
A
A
A
A
A
V
A
R
A
R
V
V
f = 1 kHz
f = 1 kHz
f = 1 kHz
2 V
R
A
NTSC
R
A
NTSC
V
V
V
V
V
PP
V
V
O
O
V
V
L
L
L
L
= +2
= +10
= −1
= −10
= −1, V
= −1, V
= 150Ω (Note 6)
= −1, V
= 150Ω
= 150Ω
= +2
= 150Ω
= +2
= 1 V
= 1 V
PP
PP
Conditions
, 10 MHz
, 10 MHz
PP
PP
O
O
O
= 4
=
=
±
±
2V,
2V
J
±
= 25˚C.
5V, R
(Note 4) (Note 5) (Note 4) (Note 5) (Note 4) (Note 5)
Typical
0.063
0.16
500
−45
−55
8.5
50
40
55
35
40
50
16
LM6181AM
8
3
4
6
F
= 820Ω, and R
Limit
375
35
Typical
L
0.063
0.16
500
−45
−55
8.5
= 1 kΩ unless otherwise noted. Boldface lim-
50
40
55
35
40
50
16
8
3
4
LM6181AI
Limit
375
35
Typical
−
0.063
0.16
500
−45
−55
for proper operation. The typical
8.5
50
40
55
35
40
50
16
8
3
4
LM6181I
Limit
375
35
Units
MHz
V/µs
Deg
dBc
min
min
ns
%